TSMC Solid State Lighting Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Huai-En Lai

Hsin-Hsien Wu

Fu-Wen Liu

Yung-Chang Chen

Ming Shing Lee

Andy Wu

Hsiao-Wen Lee

Chyi Shyuan Chern

Yu-Sheng Tang

Tien-Ming Lin

Shang-Yu Tsai

Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.

Refractive index tuning of wafer level package LEDs

An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.

Light emitting diode optical emitter with transparent electrical connectors

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Fengshan, Taiwan

Huai-En Lai