Huawei Technologies Co., Limited

Huafeng Zhang

Peng Yuan

Guowen Liu

Shuai Zheng

Laicun Lin

Jiajie Tang

Yuehua Luo

Shijuan Jia

Guanhong Ye

A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.

Chip package device

Embodiments of the present disclosure relate to a communications apparatus and a wireless communications device. The communications apparatus includes M communications sublinks including M sub antenna arrays divided into at least two rows. Two adjacent sub antenna arrays are arranged in an interleaved manner, or the M sub antenna arrays are arranged on a straight line, and the two adjacent sub antenna arrays share n elements.

Communications apparatus and wireless communications device

Growing community of inventors

Shanghai, China

Huafeng Zhang