Koninklijke Philips Corporation N.V.

Lumileds LLC

Hua Sin Yew

Hui Ling Pan

Jin Cherl Kwon

Hiu Tung Chu

Xinping Yan

A light-emitting device (A) includes: a lead frame () including a die paddle () and a lead () spaced apart from each other; a light-emitting die () attached on the die paddle (); a wire () bonding the light-emitting die () to the lead (), wherein a first end () of the wire () and a region of the light-emitting die () to which the first end () of the wire () is bonded form a first necking area (); a first resin cover () covering the first necking area (); and a second resin cover () covering the first resin cover (), the light-emitting die (), and the wire (). The first resin cover () has a hardness lower than a hardness of the second resin cover ().

Growing community of inventors

Penang, Malaysia

Hua Sin Yew