Shennan Circuits Co., Ltd.

Radial Electronics, Inc.

Hua Miao

Lixiang Huang

Weijing Guo

Yuhua Zeng

Zedong Wang

James Quilici

Guodong Wang

Zhanhao Xie

Xiaofeng Liu

Jin Dong

Chuanzhi Li

Rui Wang

Hao Luo

Jun Peng

Xudong Chen

Beilei Wang

Tengfei Yao

Yongkai Li

The present application relates to the technical field of circuit boards. In particular, disclosed are an optical fiber circuit board assembly and an electro-optical circuit board. The optical fiber circuit board assembly comprises a substrate, which comprises a substrate body, the substrate body at least being provided with a first window; and a plurality of optical fiber units, which are arranged on the substrate, wherein one end of each of the plurality of optical fiber units extends to the first window and is used for being coupled to a plurality of optical devices, and the other end of each of the plurality of optical fiber units extends to the outside of the substrate. By the means, according to the present application, the assembly of optical interconnection and electrical interconnection can be simplified, thereby greatly improving efficiency.

Optical fiber circuit board assembly and optical-electrical hybrid circuit board

A graded-index polymer waveguide () and a manufacturing method thereof are provided. The method includes providing a waveguide substrate (); manufacturing a waveguide lower cladding layer () on a surface of the waveguide substrate (); coating a material of a waveguide core layer () having UV photosensitivity on a surface of the waveguide lower cladding layer () away from the waveguide substrate (); performing a hot imprinting process for the material of the waveguide core layer by means of a flexible transfer film mold and forming a waveguide core layer () having an imprinted waveguide link structure; performing a heat treatment process for the waveguide core layer (); performing a pre-exposure process for the waveguide core layer; coating a waveguide upper cladding layer on a surface of a waveguide core layer (); and curing the waveguide core layer () and the waveguide upper cladding layer ().

Graded-index polymer waveguide and manufacturing method thereof

An integrated transformer and an electronic device are provided. An integrated transformer includes at least one substrate defining a plurality of annular accommodating grooves. Each annular accommodating groove divides a corresponding substrate into a central part surrounded by the each annular accommodating groove and a peripheral part arranged around the each annular accommodating groove. The central parts and the peripheral parts, magnetic cores received in the annular accommodating grooves and conductive connectors assembled on the at least one substrate, and transmission wire layers on both sides of the at least one substrate cooperatively constitute a plurality of transformers and filters arranged according to preset arrangement manners. At least one of the transformers and at least one of the filters are electrically connected to form a group of electromagnetic assemblies, and any two groups of electromagnetic assemblies are not electrically connected with each other on the at least one substrate.

Integrated transformer and electronic device

An electromagnetic device includes a substrate, magnetic cores, transmission line layers, and conductive members. The substrate is provided with annular receiving grooves for accommodating the magnetic cores; the substrate is divided into a central portion and a peripheral portion; inner and outer via holes are respectively formed on the central portion and the peripheral portion, respectively; the transmission line layers each including wire patterns are respectively provided on opposite sides of the substrate; and the conductive members are sequentially connected to the wire patterns on both sides of the substrate to form a transformer and/or a filter; the electromagnetic device has a first side provided with a slot and a second side parallel to the transmission line layers; and first conductive pins electrically connected to the at least one transmission line layers are provided on at least one of the side wall surrounding the slot and a second side.

Electronic device, connector, and electromagnetic device thereof

The present disclosure provides an adapter board, a for manufacturing the same and a circuit board assembly. The adapter board includes a board body, a first component buried in the board body, a first connector located on a first surface of the board body and configured to be connected with a circuit board and a second component, a second connector located on a second surface of the board body and configured to be connected with a second component, a first conductive body and a second conductive body buried in the board body. One end of the first conductive body is connected with the first component. The other end of the first conductive body is connected with the first connector. One end of the second conductive body is connected with the first component. The other end of the second conductive body is connected with the second connector.

Adapter board, method for manufacturing the same and circuit board assembly using the same

Disclosed are an electronic component package, an electronic assembly, and a voltage regulation module. The electronic component package includes a substrate and a first electronic component. The substrate includes a first surface and a second surface; wherein the first surface is arranged with a first conductive layer, and the second surface is arranged with a second conductive layer. The substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer. The first electronic component is received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole. The first electronic component is a passive electronic component.

Electronic component package, electronic assembly, voltage regulation module, and voltage regulator member

The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

Electronic component, voltage regulation module and voltage stabilizer

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

Method for manufacturing embedded circuit board, embedded circuit board, and application

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

Circuit board and method for manufacturing the same

A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.

Transformer, electromagnetic device and manufacturing method of the transformer

An integrated transformer and an electronic device are disclosed. The integrated transformer includes at least one first base plate and at least one second base plate. Each of the first and second base plate defines multiple annular accommodating grooves. The annular accommodating grooves divide each of the first and second base plate into multiple central parts and a peripheral part Each central part defines multiple inner via holes there through. The peripheral part defines multiple outer via holes there through. The integrated transformer further includes multiple magnetic cores disposed in the respective annular accommodating groove and transmission wires disposed on both sides of the first and second base plates. Transformers and the filters are arranged on two base plates respectively, and the thickness of the transmission wire layers of the filters is less than that of the transformers. Thus, the structure of the electromagnetic device may be more compact.

An electromagnetic device and a method for manufacturing the same are disclosed. The electromagnetic device includes a base plate, a magnetic core, multiple transmission units, and connection layers. The base plate includes a central part defining multiple inner via holes and a peripheral part defining multiple outer via holes. An annular accommodating groove is defined between the central part and the peripheral part. The magnetic core is received in the annular accommodating groove. Transmission units are located on both sides of the base plate. Each transmission unit includes a transmission wire layer including multiple conductive wire patterns, and each conductive wire pattern bridges one inner via hole and one outer via hole. Each of the connection layers is set on one side of the transmission wire layer close to the base plate. At least one connection layer has a dielectric loss no larger than 0.02.

Electromagnetic device and method for manufacturing the same

The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

Embedded circuit board and method of manufacturing same

A cable connection apparatus, a connection assembly, and a method for manufacturing the connection assembly are provided. The cable connection apparatus includes: a back plate and a connection member. The back plate includes a plate body and a ground layer. The plate body defines a through hole and a plurality of shielding holes. The plurality of shielding holes are defined at a periphery of the through hole. The ground layer is arranged on each of two opposite sides of the plate body and is connected to each of the plurality of shielding holes. The connection member abuts against or connects to a surface of a side of the back plate arranged with the ground layer. The connection member is arranged with a signal pin, and the signal pin is received in the through hole.

Cable connection apparatus, connection assembly, and method for manufacturing connection assembly

A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

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Shenzhen, China

Hua Miao