Tpk Touch Solutions (xiamen) Inc.

Hua Li Luo

Jing Yu

Huilin Ye

Ching-Kai Cho

Zhi Juan Lin

Ting-Chieh Chien

Wei Jie Lin

Yau-Chen Jiang

Tsung-Ke Chiu

Defa Wu

Jianbin Yan

Zongke Chiu

The disclosure provides a border touch module, including a cover plate, a shielding layer, a first adhesive layer, a sensing electrode layer, a second adhesive layer, an opaque adhesive, and a backlight layer. The shielding layer is disposed below the cover plate. The first adhesive layer is disposed below the shielding layer. The sensing electrode layer is disposed below the first adhesive layer. The second adhesive layer is disposed below the sensing electrode layer. The opaque adhesive is disposed below the sensing electrode layer. The backlight layer is disposed below the opaque adhesive and is in the same plane as the second adhesive layer. The shielding layer has a backlight pattern, and the opaque adhesive has a light source hole. When the backlight layer is in the state of driving backlight, the light illuminates the backlight pattern of the shielding layer through the light source hole.

Border touch module

A touch panel used for a touch control electronic device is disclosed. The touch panel comprises a first board. The first board has a first surface, wherein the first surface undergoes an atomizing process to have at least one semitransparent area. The at least one semitransparent area has a first semitransparent figure which is interlaced by an atomized area and a non-atomized area for changing a light shielding rate of the first semitransparent figure by adjusting the atomized area.

Touch panel

The present disclosure discloses a bonding structure, wherein a plurality of first bonding pads is located on a first substrate. A second substrate is disposed to partially face first substrate. A plurality of second bonding pads is located on second substrate with one side, and partially overlapped with the first bonding pads with the other side to form a bonding region and a peripheral region located in the periphery of the bonding region. An anisotropic conductive film is disposed between first bonding pads and second bonding pads. The anisotropic conductive film includes a plurality of conductive particles. At least one groove structure is disposed in the periphery region. When the conductive particles of the anisotropic conductive film are moving during the bonding process, the groove structure can accommodate the conductive particles moved hereto. Accordingly, short circuit caused by accumulation of the conductive particles in the bonding process can be avoided.

Bonding structure

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Province, China

Hua Li Luo