Mosel Vitelic Corporation

Hua-Jen Tseng

Chun-Chieh Lee

Pei-Wei Tsai

Dong-Tay Tsai

Sheng-Feng Hung

Yi-Hua Chin

Tzu-Hsin Huang

Gwo-Yuh Yang

Yung-Tsun Lo

Chih-Hsien Chang

Chun-chieh Lee

Yu-Hua Yeh

Min-Huei Lin

Cheng-Min Pan

Muh-Lang Jang

Hung-Lin Ke

Fu-Chih Huang

One embodiment is directed to a method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality of primary holes and a plurality of primary notches. The method comprises providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter; and trimming the rubber plate using the template as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.

Method for preparing rubber plate used in an ion implanter

A heating lamp bracket for reaction chambers of evaporation coating machines. The heating lamp bracket uses paired and insulation devices to mount heating lamps to a chamber wall of a reaction chamber. The bracket includes a mounting frame that has an insulation outer surface and a mounting outer face opposing to the insulation outer surface. The insulation outer surface has at least one insulation member located thereon for fastening the mounting frame to the chamber wall. The mounting outer surface has at least two independent mounting spots for connecting respectively a connection end of the corresponding heating lamp. The independent mounting spots and non-encased type insulation members of the present invention allows for the replacement of the heating lamps and defective insulation.

Heating lamp brackets for reaction chambers of evaporation coating machines

A chemical mechanical polishing apparatus has a plurality of electric machines for executing mechanical polishing motions, at least two control systems for controlling the mechanical polishing motions, at least two signal wires connected with the two control systems for transmitting signals of the two control systems, and a wave filter comprising two terminals connected with the two signal wires respectively for filtering out the signal whose voltage exceeds a predetermined value in the two signal wires.

Chemical mechanical polishing apparatus with stable signals

A plate-tilting apparatus adapted to be used in a semiconductor-manufacturing process is disclosed. The plate-tilting apparatus is used for preventing thin wafers from being collected in a cassette contacted with each other after the thin wafers are taken out of a solution. It includes a plate having the container locked thereon and having a first edge pivotally connected to a basal plane of a tank used in the semiconductor-manufacturing process, and a plate-lifting device connected to a second edge of the plate opposite to the first edge for lifting the second edge of the plate, so that the plate can be tilted at a specific angle.

Plate-tilting apparatus

A wafer load/unload apparatus used to load/unload the wafer into/from the clamp ring for performing the E-Gun evaporation process is disclosed. The apparatus comprises a base, a central cylinder and a plurality of peripheral cylinders. The base has an even upper surface, and the central cylinder and the plurality of the peripheral cylinders are connected to the upper surface of the base respectively, wherein the plurality of the peripheral cylinders are located around the central cylinders. A recessed trench penetrating through sidewalls of the central cylinder is formed on a top surface of the central cylinder. The central cylinder can penetrate through a clamp ring, wherein the clamp ring is used to load a wafer for performing the E-Gun evaporating process. The spacing distances between the plurality of peripheral cylinders and the central cylinder are bigger than the width of the clamp ring. The plurality of peripheral cylinders are used to prevent the wafer which is placed on the top surface of the central cylinder from falling down.

Wafer load/unload apparatus for E-Gun evaporation process

An inspection device for examining a piece of aperture graphite of an extraction electrode, and the aperture graphite includes a to-be-examined curve and a to-be-examined engagement portion. The inspection device includes a sidewall surface having a standard curve marked thereon, and an examination engagement portion having a predetermined positional relationship with the sidewall surface. After the to-be-examined engagement portion is engaged with the examination engagement portion, and after the to-be-examined curve is projected onto the sidewall surface, the suitability of the aperture graphite can be determined according to the amount of differences between the projected to-be-examined curve and the standard curve.

Inspection device for examining a piece of aperture graphite of an extraction electrode

A structure for connecting fluid channel of fluid delivery system is disclosed. This connecting structure limits the length of the flow-guiding pipe extending into the delivery channel, to reduce particle contaminates and the probability of crack. The present pipe union connecting structure comprises a first pipe, a second pipe mounted to the first pipe, and an inner pipe extending from the first pipe into the second pipe with a certain extending length. The extending length of the inner pipe is less than the proportion of the minimum distance between the inner wall of the second pipe and the outlet of the inner pipe when standstill, to the tangent value of a certain angle &thgr;, which is the maximum inclined angle between the second pipe and the inner pipe.

Connecting structure between fluid channel

A novel insulating apparatus for a conductive line is disclosed. The proposed insulating apparatus can be applied to various conductive lines with different shapes. The problem of short circuit can be solved by the present insulating apparatus with the novel connecting configuration. The present invention comprises a plurality of insulator rings worn on the conductive line in series, wherein the insulator rings are annular cylinders. Each of the annular cylinders has an outer diameter larger than the inner diameter of the ones next to it. In addition, each of the annular cylinders has a length sized according to the desired flexibility of the conductive line.

Insulating apparatus for a conductive line

The present invention relates to an ion source chamber of a high energy implanter. The ion source chamber comprises a main chamber for generating ions for ion implantation, a vent-pipe having two open ends, one end of the vent-pipe being connected to the main chamber for releasing air from the main chamber, a releasing valve connected to another end of the vent-pipe for releasing the air in the main chamber when the pressure of the air in the main chamber exceeds a predetermined pressure, and a filtering device installed between the vent-pipe and the releasing valve for filtering impurities contained in the air carried by the vent-pipe so as to prevent the impurities from falling into the releasing valve.

Ion source chamber of a high energy implanter with a filtering device

A height gauge device for wafer, which is mounted under a cooling water pipe of a back-grinding machine; the device comprises a height gauge box, a measuring rod, a L-shaped linking rod and a resilient member; a signal sensor is mounted inside the height gauge box for measuring the height of a wafer; both ends of the measuring rod are connected with the signal sensor and the L-shaped linking rod respectively; the L-shaped linking rod is mounted with a probing needle; the resilient member is mounted between the L-shaped linking and the cooling water pipe; in height gauging operation, the probing needle on the L-shaped linking needle should be raised first so as to put a wafer under the probing needle, and to have the probing needle pressed against the wafer by means of the resilient force of the resilient member; consequently, the resilient member is subject to elastic fatigue or break; the resilient member of the height gauge device can be replaced directly without opening the height box so as to save time and maintenance cost.

Height gauge device for wafer

A clamp used in clamping semi-conductor wafers during processing operations permits ready release of the wafer and avoids adherence of the clamp to materials deposited onto the wafer which otherwise tend to stick the wafer to the clamp. Adhesion of the deposited materials to the clamp is avoided by providing the clamping surfaces of the clamp with a minimum surface roughness achieved by machining, grinding, etching or other techniques.

Non-sticking semi-conductor wafer clamp and method of making same

An arc chamber including a reaction chamber, a filament element used to generate electrons, a first power supply means set for providing power to the filament element, a second power supply means utilized for creating a potential to increase the ionization efficiency, a plurality of gas injected openings set to inject suitable gas into the reaction chamber and be ionized in a gaseous plasma by impact from electrons, a first filament insulator, and three second filament insulators used for isolation. The first filament insulator includes a truncated corn portion and a ring portion. The truncated corn portion has a hole formed threrethrough itself. The ring portion is coaxially connected to the smaller surface of the truncated corn portion. The second filament insulator includes a truncated corn portion and two ring portions. Similarily, the truncated corn portion has a hole through formed therethrough. The ring portions are respectively coaxially connected to the two surfaces of the truncated corn portion. In the preferred embodiment, three first filament insulators and one second filament insulator are set on the filament element for isolation. The filament insulators are screwed into the filament element and exactly attached on the side wall of the reaction chamber.

Growing community of inventors

Hsinchu, Taiwan

Hua-Jen Tseng