Inventec Corp.

Inventec (pudong) Technology Corporation

Hua-Feng Chen

Yu-Hsuan Lin

Chih-Kai Yang

Yi-Lun Cheng

Feng-Ku Wang

Ming-Hung Lin

Ting-Chiang Huang

Meng-Lung Chiang

Wei-Yi Lin

Huang-Cheng Ke

Te-Chuan Wang

Wei-Hsin Wu

A heat dissipation estimating method is disclosed. The heat dissipation estimating method includes following steps: providing an input heat to a fin of a heat sink unit; obtaining an average temperature of the fin according to the input heat; obtaining an output heat according to the average temperature; determining whether the input heat is the same as the output heat or not; while the input heat is different from the output heat, updating the input heat according to the output heat and repeating the above steps until the input heat is the same as the output heat; and while the input heat is the same as the output heat, obtaining a total heat dissipation value of the heat sink unit according to the input heat and a ratio value.

Heat dissipation estimating method

An electronic device includes a case, a control module, a plurality of heat sinks and at least one airflow guiding structure. The case includes a bottom plate, a top plate, and at least one side plate. The bottom plate has a plurality of bottom holes for guiding air into the case. The top plate has a plurality of top holes for exhausting air in the case. The side plate connects the top plate and the bottom plate and has a plurality of side holes for exhausting air in the case. The control module is disposed in the case. The heat sinks are thermally connected to the control module. The airflow guiding structure is disposed between the heat sinks for guiding a part of the air in the case to the exterior of the case through the side holes.

Electronic device with phase change material microcapsule layer

A fan structure used for connecting with a plate body includes a main body, a fan blade, a sliding member and a locating member. The main body has an accommodating space and an adjustment slot. The fan blade is pivotally disposed on the main body and is located inside the accommodating space. The sliding member has a base and a joining portion. The base is accommodated in the adjustment slot. The sliding member is joined to the plate body through the joining portion. The locating member is used for joining the sliding member and the main body together, so as to fix the relative position of the sliding member and the main body.

Fan structure and casing structure

The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Electronic device and heat dissipation module thereof

Growing community of inventors

Taipei, Taiwan

Hua-Feng Chen