Aac Technologies Pte. Ltd.

Tencent Technology (Shenzhen) Company Limited

Aac Acoustic Technologies (Shenzhen) Co., Ltd.

Zte Corporation

Huawei Technologies Co., Limited

Hu Chen

Jian Zhang

Elena Alexandrovna Alshina

Kai Wang

Jiantong Zhou

Min Ren

Hu Lan

Jinyu Zhang

Quanhe Yu

Ruihua Li

Qing Qin

Jun Zang

Weiwei Xu

Yichuan Wang

Zi Chao Tang

Guojun Liu

Jin Long Chen

Yi Ge Cai

Zong Zhao

Luo Hai Zheng

Jun Jie Shi

Chuan Bing Dai

A service processing method, apparatus, and storage medium of a blockchain system are provided. The service processing method includes obtaining authentication information of a service participant; determining whether data in the authentication information of the service participant is updated; generating, based on the data in the authentication information of the service participant being updated, a notification message according to the updated data; and transmitting the notification message to a service processing node subnetwork, the notification message instructing one or more service processing nodes in the service processing node subnetwork to process a service request according to updated authentication information of the service participant.

Service processing method and apparatus based on blockchain system, medium and electronic device

A terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed at the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, and an MEMS chip accommodated in the accommodation space. A position of the substrate corresponding to the MEMS chip is disposed with a sound inlet connected to the outside, wherein a position where the signal let out board corresponding to the silicon microphone is disposed with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate disposed with the housing is provided with a pad which is electrically connected with the signal let out board.

Terminal assembly structure of MEMS microphone

The present disclosure provides a terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed on the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, an MEMS chip and a waterproof member. The substrate is configured with a sound inlet connected to the outside. The waterproof member is sandwiched between the MEMS chip and the substrate. A position where the signal let out board corresponds to the silicon microphone is configured with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate where the housing is assembled, is provided with at least one pad electrically connected with the signal let out board.

A method, blocking device, and a non-transitory computer-readable storage medium are provided. For example, the method is performed by processing circuitry of the blocking device. In the method, alarm data that includes attacking information of attacking packets among packets that enter a service network that provides services to servers is received. The alarm data is generated based on parsing the packets to identify the attacking packets and to determine the attacking information of the attacking packets. A blocking policy for blocking the attacking packets is determined based on the alarm data and blocking rules for determining whether the servers are attacked. A blocking action is initiated to block the attacking packets based on the blocking policy.

DDoS attack defense method, system, and related device

An MEMS microphone is provided in the present disclosure. The MEMS microphone includes a protective structure comprising a housing and a PCB substrate covering the housing to form a receiving space, the housing is provided with a sound hole, an MEMS chip with a back cavity, received in the receiving space and fixed on the PCB substrate, the back cavity is communicated with the sound hole, and the MEMS chip comprises a first surface away from the PCB substrate and a second surface opposite to the first surface; and a waterproof part, bonded to the first surface of the MEMS chip.

MEMS microphone

A MEMS microphone is disclosed. The MEMS microphone includes an encapsulation structure provided with an accommodation space; a MEMS chip for detecting sound signal accommodated in the accommodation space; an ASIC chip received in the accommodation space. The ASIC chip includes a signal processing module connected to MEMS chip for processing the sound signal detected by the MEMS chip and outputting the processed sound signal. The MEMS microphone further includes a temperature detection module for detecting temperature signal and outputting the temperature signal.

To detect the ambient temperature around the MEMS microphone

The MEMS microphone includes a first circuit board; a second circuit board keeping a distance from the first circuit board; a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole; an ASIC chip located in the cavity; and an MEMS chip having a back cavity. The first circuit board is electrically connected with the second circuit board by the plated-through-hole. The frame includes a conductive layer and an insulating layer, and the conductive layer is located between an inner surface of the frame and the insulating layer.

The invention discloses an overlapping command committing method of dynamic cycle pipeline, for a chip having pipeline structure, the method comprising the following steps: reading the command from command buffer, decoding the command, judging whether operator is reasonable or not, if a illegal command, then deleting, otherwise preprocessing the operator of command, preparing the initial operator of each pipeline, and observing the status of pipeline, waiting for pipeline command exiting signal, and judging whether there is command relevance or not, if not, then committing a new command to pipeline when the command exiting a last cycle of pipeline. Overlapping command committing method of the invention can avoid appearing of bubble, improve parallelism of pipeline performing unit, and thus shorten the processing period of command in chip, let the chip process more command in unit time.

Overlapping command at one stage submitting method of dynamic cycle pipeline

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Shenzhen, China

Hu Chen