Industrial Technology Research Institute

Industrial Technology Research Center

Hsueh-Yi Liao

Chyi-Ming Leu

Chun-Wei Su

Chi-Fu Tseng

Chih-Cheng Lin

Tzong-Ming Lee

Yung-Lung Tseng

A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A' is an aromatic or aliphatic group, and 1&#x2266;n/m&#x2266;4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Method for fabricating flexible electrical devices

Disclosed is a polyimide polymerized by x molar parts of a first diamine, y molar parts of a second diamine, and 100 molar parts of a first dianhydride, wherein the first diamine has a formula of the second diamine has a formula of the first dianhydride has a formula of a+b=100, 50&#x2266;x&#x2266;80, and 20&#x2266;y&#x2266;50.

Polyimides

A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T).  One of B and B' is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1&#x2dc;4, A and A&#x2032; are identical or different aromatic diamines, and at least one of A and A&#x2032; is aromatic diamine with ether groups, and A could be the same as or different from A&#x2032;.

Polyimide polymer solution, polyimide polymer, transparent film, displaying device and solar cell

A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The disclosure also provides a method for fabricating the substrate structure.

Substrate structures applied in flexible electrical devices and fabrication method thereof

A release layer material of cyclic olefin copolymers (COC) applied in flexible electrical devices represented by Formula (I) or (II) is provided. The invention also provides a substrate structure including the release layer. The substrate structure includes a carrier, a release layer overlying the carrier with one or more blocks with a first area, wherein the release layer includes cyclic olefin copolymers (COC) represented by the disclosed Formula (I) or (II), and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention further provides a method for fabricating the substrate structure.  In Formula (I) or (II), X is 30-70, X+Y is 100 and R is &#x2014;H, &#x2014;CH3 or &#x2014;C2H5.

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Yonghe, Taiwan

Hsueh-Yi Liao