Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsueh-Lei Wang

Jiun-Rong Pai

Chih-Hung Huang

Yang-Ann Chu

Tsung-Sheng Kuo

Hsuan Lee

Jen-Ti Wang

Ting-Wei Wang

Wen-Chieh Tsou

In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

Systems and methods for die container warehousing

A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.

Method for cleaning load port of wafer processing apparatus

Growing community of inventors

Taipei, Taiwan

Hsueh-Lei Wang