Industrial Technology Research Institute

Karl Storz-gmbh & Co. Kg

Hsueh-Chih Chang

Hung-Lieh Hu

Chao-Wei Li

Shih-Yi Wen

Rong Xuan

Mu-Tao Chu

Jui-Ying Lin

Sheng-Pan Huang

Chih-Hao Hsu

Yuan-Ching Chen

Han-Kuei Fu

Chiu-Ling Chen

Hsiang-Chi Chung

A thermal image sensing system including at least one thermal sensor, at least one light sensor, an image identification module, a storage module and a computing module is provided. The thermal sensor senses thermal radiation emitted by an object and generates a thermal radiation image signal correspondingly. The light sensor senses visible light reflected by the object and generates at least one visible light image signal correspondingly. The image identification module receives the visible light image signal generated by the light sensor and determines a material of the object according to the at least one visible light image signal. The storage module stores a radiation coefficient of the material of the object. The computing module calculates a surface temperature of the object according to the radiation coefficient of the material of the object and the thermal radiation emitted by the object. A thermal image sensing method is also provided.

Thermal image sensing system and thermal image sensing method

A light source module adapted to provide a superposition structured pattern includes a light emitting device adapted to provide a light beam, a light guiding element including a polarizing beam splitter to separate the light beam into a first light beam and a second light beam, a first diffractive element configured to convert the first light beam into a first structured light, and a second diffractive element configured to convert the second light beam into a second structured light. Polarization states of the first light beam and the second light beam are different. The first and second structured lights are projected into a projection region, and overlapped and imaged as a superposition structured pattern. The projection region has sub-projection regions arranged in a matrix and adjacent to each other, and the pattern distribution of the superposition structured pattern in each sub-projection region is different from each other.

Light source module, sensing device and method for generating superposition structured patterns

An illuminating device is provided. The illuminating device includes a light source and a lampshade. The light source provides a first light beam and a second light beam. The lampshade includes a first curved surface and a second curved surface. The first light beam is refracted by the first curved surface. The second light beam is reflected by the second curved surface, and a curvature of the first curved surface differs from a curvature of the second curved surface.

Illuminating device

A lighting module comprises a first light source, a second light source and a phosphor element is provided. The first light source emits a first exciting light. The second light source emits a second exciting light. The phosphor element converts the first exciting light and the second exciting light to an emission light. The first exciting light and the second exciting light are input to the phosphor element in different directions of incidence.

Lighting module and optical fiber lighting device using the same

A light source module optically coupled to an optical fiber which has a light incident surface is provided. The light source module includes a plurality of light sources and a concentrator. The light sources surround an axis, and the axis passes through a center of the light incident surface and is perpendicular to the light incident surface. Each of the light sources is capable of emitting a beam along a transmitting path toward the axis. The concentrator is disposed at the axis and includes a curvy reflective surface located on the transmitting paths for reflecting the beams to the light incident surface of the optical fiber.

Light source module

A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.

Light emitting chip package module and light emitting chip package structure and manufacturing method thereof

A lighting system for dim ambience has at least one light source module, implemented in an ambience. The light source module has multiple light emitting units. Each unit is respectively controlled to produce a luminance. A luminance detecting unit detects a photonic luminance and a luminance ratio. A processing and operation module calculates a mesopic luminance according to the photonic luminance and the luminance ratio. When the photonic luminance is less than a dim-light setting value, a power control information is obtained by a fitness operation with a given condition set. The power control information is corresponding to an optimized mesopic luminance after fitness. A control unit receives the power control information to modulate the luminance of the light emitting units.

Growing community of inventors

Changhua County, Taiwan

Hsueh-Chih Chang