Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Hsuanwei Mai

Zhanfeng Cao

Zhiwei Liang

Zhijun Lv

Guangcai Yuan

Ke Fei Wang

Yingwei Liu

Muxin Di

Han Yue

Haixu Li

Ke Wang

Huijuan Wang

Xue Dong

Minghua Xuan

Xinhong Lu

Guoqiang Wang

Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.

Intermediate substrate and fabrication method of display panel

A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Display backboard and manufacturing method thereof and display device

Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.

Transfer carrier and manufacturing method thereof, and method for transferring light-emitting diode chip

A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

Display backplane and method of manufacturing the same, display device

The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.

Mass transfer method and system for micro light emitting diodes

The present disclosure provides a protection circuit for protecting a light emitting element, a pixel unit including the protection circuit, a display panel, and a driving method of the protection circuit. The protection circuit for protecting the light emitting element includes: a bonding protection sub-circuit including a sacrificial metal region, configured to electrically couple the sacrificial metal region to an anode pad and a cathode pad on the backplane for bonding the light emitting element during a period of bonding the light emitting element to the backplane.

Protection circuit for protecting light emitting element, method for driving the protection circuit, pixel unit and display panel

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Beijing, China

Hsuanwei Mai