Advanced Semiconductor Engineering, Inc.

Hsu-Liang Hsiao

Lu-Ming Lai

Ching-Han Huang

Ying-Chung Chen

Chia-Hung Shen

Sung-Fu Yang

Yu-Hsuan Tsai

Pu Shan Huang

At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

Semiconductor device package and a method of manufacturing the same

A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.

Microelectromechanical systems package structure

An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.

Optical device, optical module structure and manufacturing process

An optical module structure includes a light source, a light receiver, a dielectric layer, a circuit layer, an encapsulant and a light shielding structure. The light source is embedded in the encapsulant, and a first surface of the light source is exposed from a first surface of the encapsulant. The light receiver is embedded in the encapsulant, and a first surface of the light receiver is exposed from the first surface of the encapsulant. The dielectric layer is disposed on the first surface of the encapsulant. The circuit layer is disposed on the dielectric layer and electrically connected to the light source and the light receiver. The light shielding structure is disposed in the dielectric layer corresponding to a location between the light source and the light receiver.

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Kaohsiung, Taiwan

Hsu-Liang Hsiao