Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsing-Yuan Huang

You-Hua Chou

Chin-Szu Lee

Szu-Hua Wu

Chien Lin

Yi-Chen Ho

Tsung-Yu Tsai

Meng-Chun Hsieh

Chih-Chang Wu

Cheng-Yu Hung

A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

System and method for performing semiconductor processes with coated bell jar

A semiconductor device includes a semiconductor substrate, a capacitor, and an interconnection layer. The capacitor is over the semiconductor substrate and includes a bottom electrode, a top electrode, and an insulator layer. The top electrode has a top surface and a bottom surface rougher than the top surface of the top electrode. The insulator layer is between the bottom electrode and the top electrode. The interconnection layer is over the semiconductor substrate and is electrically connected to the capacitor.

Semiconductor device and manufacturing method thereof

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Taoyuan, Taiwan

Hsing-Yuan Huang