Cisco Technology, Inc.

Hsing-Sheng Liang

Saeed Seyed

Phillip S Ting

Hong Huynh

Michael Chern

Jim C Chiappe

Sridevi Iyengar

Luca Cafiero

Sergio D Camerlo

Toan N Nguyen

Yida Zou

Gary L Myers

Kamran Esmaily

Robert E Newhall

Michael Koken

Bobby Parizi

Yuan-Cheng Fang

George Sya

James Cushman

An example apparatus and method for preventing component overheating and extending system survivability of an appliance is provided and may include a component assembly configured to be inserted in a first slot of the appliance. The component assembly may include a door disposed on its side and extending substantially along the length of the component assembly. The door is movable between a first and a second position and the component assembly is configured so that when the component assembly is inserted in the first slot and the trap door is in the second position, the trap door provides a barrier to airflow in a second slot of the switch that is adjacent to the first slot when a second component assembly has been removed from the second slot.

Apparatus and method for preventing component overheating and extending system survivability

Methods and apparatus for shielding an object from relative high electromagnetic radio frequencies while allowing airflow to pass to and from the object are disclosed. According to one aspect of the present invention, a shield arrangement that shields a chassis includes at least a first plane and a second plane. The first plane has a thickness and defines a first plurality of openings that include a first opening and a second opening that are separated by at least a distance that is a function of the thickness. The second plane defines at least a third opening, and is approximately parallel to the first plane. The second plane is spaced apart from the first plane by a spacing that is a function of at least the thickness.

Providing airflow to an electronics enclosure while providing protection and shielding against electromagnetic interference

An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.

Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board

A method is performed in an electronic system having (i) hardware configured to perform electronic operations and (ii) an air filter configured to remove contamination from an air stream that cools the hardware. The method, which identifies when to change an air filter, involves obtaining, from a set of particle sensors, a set of sensor signals in response to sensed particles in the air stream. The method further involves generating particle count data and processing the data based on the set of sensor signals, and providing an output signal having one of a first value and a second value based on the particle count data. The output signal indicates that the air filter should be changed when the output signal has the first value. The output signal indicates that the air filter should not be changed when the output signal has the second value.

Techniques for identifying when to change an air filter

An electronic interconnection system for delivering high-current power and ground voltages using a non-bottom side of a chip package substrate. The system includes a printed wiring board (PWB), a chip package, and a bridge lead. The PWB has at least a first and a second contact pad. The chip package includes a chip and a package substrate. The chip is mounted onto the package substrate and the package substrate has a bottom surface having at least a first contact pad and a second surface having at least a second contact pad. The first contact pad of the PWB and the first contact pad of the package substrate are coupled together. The bridge lead couples the second contact pad of the PWB with the second contact pad of the package substrate. The bridge lead may be selected from styles including flying lead, edge wiping, top wiping, and double wiping.

Method and apparatus for delivering high-current power and ground voltages using top side of chip package substrate

A panel member attaches to a frame that supports electronic circuitry. The panel member includes a mounting portion configured to mount to the frame, and a face portion coupled to the mounting portion. The face portion defines a plane and multiple openings within the plane. The panel member further includes multiple brimmed portions coupled to the face portion. Each brimmed portion (i) extends around an opening defined by the face portion and (ii) projects from that opening in a direction which is away from the plane. The use of such a panel member provides improved airflow and stagnation pressure as well as robust electromagnetic interference protection.

Techniques for providing ventilation and EMI shielding to electronic circuitry using a panel member with brimmed holes

An air stream distribution apparatus directs portions of an air stream, at substantially ambient temperatures, to serially arranged circuit board components of a circuit board assembly. The air stream distribution apparatus splits an incoming air stream into air stream portions and directs each air stream portion toward each serially arranged circuit board component. Such direction of the portion of the air stream, by the air stream distribution apparatus, minimizes overheating and failure of the circuit board components. Furthermore, the air stream distribution apparatus minimizes a decrease in the pressure of the air stream as the air stream travels from the air stream source. The air stream distribution apparatus, therefore, ensures that circuit board components located at relatively large distances from the air stream source receive air from the air stream to minimize overheating and potential failure.

Methods and apparatus for directing an air stream through a circuit board assembly

A heat sink attachment mechanism includes a fastener having an associated compressible member. The fastener defines a flange that, as the fastener secures a heat sink to a circuit board component, is configured to contact a circuit board surface associated with the circuit board component. Contact between the flange and the circuit board minimizes the travel of the fastener relative to the circuit board component and limits the stress generated on the circuit board component or on the solder balls of a ball grid array associated with the circuit boards component by the heat sink. Also, as the fastener secures the heat sink to the circuit board component, the fastener compresses the compressible member against the heat sink, thereby causing the compressible member to expand. Expansion of the compressible member allows the compressible member to absorb changes in the stress applied by the fastener to the heat sink and circuit board component over time.

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San Jose, CA, United States of America

Hsing-Sheng Liang