Macronix International Co., Ltd.

International Business Machines Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsin-Yi Ho

Chun-Hsiung Hung

Hsiang-Lan Lung

Han-Sung Chen

Yung-Feng Lin

Ho-Chun Liou

Yun-Chen Chou

Nai-Ping Kuo

Wen-Chiao Ho

Chia-Jung Chen

Ji-Yu Hung

Chia-Ching Li

Lung-Yi Kuo

Shuo-Nan Hung

Ming-Hung Chou

Chun-Jen Huang

Nian-Kai Zous

I-Jen Huang

Gin-Liang Chen

Hsiang-Pang Li

Wei-Chih Chien

Scott C Lewis

Tien-Yen Wang

Yung Feng Lin

Hsien-Hung Wu

Richard C Jordan

Smile Huang

Kuo-Chen Huang

Jer-Hau Hsu

Hsin-Chien Chen

Tzung-Shen Chen

Tu-Shun Chen

Gin-Laing Chen

Chang-Shing Chen

Yun Chen Chou

Disclosed are a memory device and an error correction method thereof. The error correction method of the memory device includes: generating a first write-in bit and a second write-in bit according to a write-in data, and writing the first write-in bit and the second write-in bit into corresponding first memory cell and second memory cell respectively; in a reading mode, providing a page buffering circuit to read a first read bit and a second read bit from the first memory cell and the second memory cell; and providing the page buffering circuit to generate a correct readout data according to a stuck-at fault mode of the memory device, the first read bit and the second read bit.

Memory device and error correction method thereof

A memory array is provided and including a plurality of bit lines and a plurality word lines; a plurality of memory cell units, arranged at cross points of the plurality of bit lines and the plurality of word lines; a bit line switch circuit, coupled to the plurality of memory cell units and being operated to select one of the plurality of bit lines; a word line switch circuit, coupled to the plurality of memory cell units and being operated to select one of the plurality of word lines; and a voltage clamper circuit, provided in at least one of the word line switch circuit and the bit line switch circuit.

Switch circuit and memory array having the same

A memory array and structure are provided. The array includes driving elements arranged in array; memory cells arranged in array and respectively corresponding to the driving elements, where one end of each memory cell is coupled to a first end of the corresponding driving element; word lines and bit lines arranged to intersect with each other, where each word lines is coupled to control ends of the driving elements in the same word line, and each bit line is respectively coupled to the other ends of the memory cells. For each word line, the first end of one driving element is connected to the first end of at least one other driving element in the same word line by a metal line, so as to form share driving elements.

Memory array and memory structure

A memory unit, array and operation method thereof are provided. The memory unit includes at least one P-type driver having a first end coupled to a power source, a second end and a control end coupled to a word line; a memory cell having a first end coupled to the second end of the P-type driver, and a second end coupled to a bit line.

Memory unit, array and operation method thereof

A mechanism is described for accommodating variations in the read or write window which are caused by variations in the number of half-selected cells which are in each logic state and share an access line with the target cell. Roughly described, leakage current is detected on the access line in one segment of the read or write operation, and read or write current detected or generated in a second segment of the operation is adjusted to compensate for the detected leakage current. The first segment can be omitted in subsequent read or write operations if the target cell word line address has not changed and the leakage-tracked reference value has not become invalid for other reasons.

Leakage current compensation in crossbar array

An embodiment of the present invention discloses a memory device. The memory device includes a memory controller, a calculation memory and a functional circuit. The calculation memory is coupled to the memory controller, and is configured to receive a plurality of first signals to output a plurality of second signals. Each of the second signals has a reference value. The functional circuit is coupled to the calculation memory, and is configured to indicate the second signal which has the greatest or the smallest reference value among the second signals.

Memory device

An integrated circuit includes a three-dimensional cross point memory array having M levels of memory cells disposed in cross points of N first access line layers and P second access line layers. The integrated circuit further comprises first and second sets of first access line drivers. The first set of first access line drivers is operatively coupled to apply a common first operational voltage to selected first access lines in odd first access line layers. The second set of first access line drivers is operatively coupled to apply the common first operational voltage to selected first access lines in even first access layers. A plurality of sets of second access line drivers is operatively configured to apply a second operational voltage to selected second access lines in selected second access line layers.

Decoding scheme for 3D cross-point memory array

A memory device and associated control methods are provided. The memory device is electrically connected to M bit lines and N word lines. The memory device includes a memory array having memory cells and a controller. The memory cells are located at intersections of the M bit lines and the N word lines. A selected memory cell including a storage element and a selector switch is electrically connected to an m-th bit line and an n-th word line. The controller changes a cell cross voltage of the selected memory cell in the first duration, the second duration, and the post duration, respectively. The cell cross voltage in the first duration is greater than the cell cross voltage in the post duration, and the cell cross voltage in the post duration is greater than the cell cross voltage in the second duration.

Phase change memory apparatus and read control method to reduce read disturb and sneak current phenomena

A memory configured to have data read therefrom is provided. The memory includes a data port including B transmitters disposed in parallel and for transferring data on both rising and falling edges of a clock, a first memory including a first data bus including N lines on which N bits can be transferred, and a second memory including a second data bus including N lines on which N bits can be transferred. The memory includes a data path controller including a data distributor disposed between the first and second memories and being connected to the data port, wherein, on the rising edge, the data distributor distributes a first data segment comprised of B bits from the first data bus to the data port and, on the falling edge, the data distributor distributes a second data segment comprised of B bits from the second data bus to the data port.

Phase change memory array architecture achieving high write/read speed

A memory device and an operation method thereof are provided, and the operation method of the memory device includes following steps. A programming operation is performed to write an original data into a first memory array in the memory device. The original data in the first memory array is verified, and whether to generate a write signal is determined according to a verification result. An error correction code is generated according to the original data, and the error correction code and a write address are stored temporarily in a buffer circuit of the memory device. When the write signal is generated, the error correction code and the write address in the buffer circuit are written into a second memory array in the memory device.

Memory device and operation method

A method for maintaining a data set includes storing a base copy of the data set in a first non-volatile memory having a first writing speed, storing changes to the data set in a first change data set in a second non-volatile memory having a second writing speed, and generating a current copy of the data set by reading the base copy and the changes. If a threshold number of entries in the first change data set is reached, then part or all of the first change data set is moved into a second change data set in the first non-volatile memory, where the generating step includes reading the second change data set. If a threshold number of entries in the second change data set is reached, then the current copy is generated by reading the base copy and the changes in the first and the second non-volatile memory.

Difference L2P method

A program method for a multi-level cell (MLC) flash memory is provided. The memory array includes a plurality of pages and a plurality of paired pages, which correspond to the respective pages. The program method includes the following steps. Firstly, a program address command is obtained. Next, whether the program address command corresponding to any one of the paired pages is determined. When the program address command corresponds to a first paired page, which corresponds to a first page among the pages, among the paired pages, data stored in the first page to a non-volatile memory are copied. After that, the first paired page is programmed.

Program method, data recovery method, and flash memory using the same

A regulator comprises an amplifier, a bias circuit, and a current trimming circuit. The bias circuit is coupled to the amplifier and supplies a first bias current to the amplifier in a first mode of a system including the regulator. The current trimming circuit is coupled to the bias circuit to adjust the first bias current.

Low drop out regulator and current trimming device

An operation method for a memory device having a plurality of memory cells includes: reading the plurality of memory cells by a first word line voltage to get a first number of a first logic state; reading the plurality of memory cells by a second word line voltage to get a second number of the first logic state, the second word line voltage different from the first word line voltage; and using the second word line voltage as a target word line voltage if the first number of the first logic state is equal to the second number of the first logic state.

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Hsinchu, Taiwan

Hsin-Yi Ho