Advanced Semiconductor Engineering, Inc.

Hsin Lin Wu

Lu-Ming Lai

Yu-Hsuan Tsai

Ching-Han Huang

Chi Sheng Tseng

Chang Chin Tsai

Yin-Hao Chen

San-Kuei Yu

A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.

Semiconductor device packages and methods of manufacturing the same

A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.

Semiconductor package with inner and outer cavities

Growing community of inventors

Kaohsiung, Taiwan

Hsin Lin Wu