Industrial Technology Research Institute

Fortemedia, Inc.

Hsin-Li Lee

Jien-Ming Chen

Nai-Hao Kuo

Wen-Shan Lin

Cheng-Hong Lee

Feng-Chia Hsu

Tzong-Che Ho

Chin-Hung Wang

Chin-Horng Wang

Yi-Shiau Chen

Pin Chang

Kai-Hsiang Yen

Jung-Tai Chen

Li-Chi Pan

Tsung-Lung Yang

Chien-Nan Yeh

Cheng-Hsin Chuang

Chin-Wen Huang

Jin-Yao Lai

Neng-Bin Wan

Jason Pan

A MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.

MEMS microphone

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.

A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.

Back chamber volume enlargement microphone package

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.

MEMS microphone with tunable sensitivity

A microphone device is provided. The microphone device includes a microphone cover, a circuit board, an integrated circuit, a first acoustic sensor, and a second acoustic sensor. The circuit board is coupled to the microphone cover. The circuit board includes a first acoustic port and a second acoustic port. The integrated circuit is coupled to the microphone cover and the circuit board to form a first chamber and a second chamber. The first acoustic sensor is arranged in the first chamber. The second acoustic sensor is arranged in the second chamber. The integrated circuit is coupled to the first acoustic sensor and the second acoustic sensor.

Microphone device

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

MEMS acoustic transducer and method for fabricating the same

A capacitive transducer and manufacturing method thereof is provided. A multifunction device including a plurality of the capacitive transducers is also provided, where the capacitive transducers are disposed on a substrate and include at least one microphone and at least one pressure sensor or ultrasonic device.

Capacitive transducer manufacturing method, and multi-function device

An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.

Ultra thin package for electric acoustic sensor chip of micro electro mechanical system

A micro-speaker and a manufacturing method thereof are provided. The micro-speaker has a sandwich structure. The micro-speaker includes two piezoelectric material layers and a diaphragm disposed between the two piezoelectric material layers, where the piezoelectric material layers have a ring-shaped structure. The problem of insufficient sound pressure at low frequency is resolved, and the flexibility of the micro-speaker is improved.

Micro-speaker and manufacturing method thereof

A microelectronic 3-dimensional solenoid of substantially circular or oval cross-section and a method for fabricating the solenoid. The solenoid is provided including a pre-processed semiconductor substrate, two supports upstanding from and spaced-apart on a top surface of the substrate, each support has a bottom end attached to the substrate. An inductor coil which has two spaced-apart ends each attached to one of two top ends of the two supports. The inductor coil is formed of a bi-layer metal laminate that has an inner metal layer and an outer metal layer. The outer metal layer is formed of a first metal that has a coefficient of thermal expansion larger than a coefficient of thermal expansion of a second metal that forms the inner metal layer.

Microelectronic 3-D solenoid of circular cross-section and method for fabrication

A method for forming a cantilever beam probe card on a semiconducting substrate and the probe card fabricated by such method are described. The method utilizes the deposition of two separate metal layers of different metals for forming a cantilever beam and a microprobe for use as a probe needle. A sacrificial, insulating material layer such as oxide or nitride is utilized in-between the metal layers and a semiconducting substrate and is subsequently removed such that the cantilever beams are released from the semiconducting substrate except at a support portion. The present invention cantilever beam probe card formed by the method can be used to probe testing IC devices that have high pin count and fine pitch.

Method for forming cantilever beam probe card and probe card formed

A device for bump probing and a method for fabricating the device are described. The device utilizes a bimorph-structured fingers for holding onto a solder bump, or a solder ball, without causing damages to the ball. The device further utilizes a direct current to cause an electrostatic force to flatten the probe fingers prior to attaching the fingers to a solder ball and for positioning the finger over a solder ball. After the electrostatic force is removed by disconnecting the direct current from the electrodes, the fingers grip onto the solder ball making electrical connection and performing testing. The invention further provides a micro-electro-mechanical-system technique for fabricating the probing device on a semiconducting substrate.

Device for bump probing and method of fabrication

A tunable microelectronic capacitor and a tunable microelectronic inductor, each utilizing a micro-actuator fabricated by MEMS technique as a major component in the capacitor, the micro-actuator drives a dielectric plate in between to electrode plates to vary the capacitance. In the inductor, the micro-actuator drives a cantilever beam member made of a magnetic material into an inductor coil for changing the inductance of the coil.

Growing community of inventors

Tainan, Taiwan

Hsin-Li Lee