Harvatek Corporation

Hsin I Lu

Hui Yen Huang

Yu Hsi Wang

Chia Pin Chang

An LED package structure without pre-stored power sources includes a substrate unit and a LED chip. The substrate unit includes a carrier substrate, a positive conductive pin, and a negative conductive pin. The positive conductive pin is made of a first predetermined material with positive oxidation-reduction potential. The negative conductive pin is made of a second predetermined material with negative oxidation-reduction potential. The LED chip is disposed on the carrier substrate and electrically connected between the positive conductive pin and the negative conductive pin. Both the positive conductive pin and the negative conductive pin concurrently contact a predetermined liquid for generating oxidation-reduction reaction so as to generate electric powers with a predetermined driving voltage, and the LED chip is driven by the electric powers with the predetermined driving voltage for generating an indicator light source. The instant disclosure further provides a portable light-emitting device without pre-stored power sources.

Growing community of inventors

Hsinchu County, Taiwan

Hsin I Lu