Industrial Technology Research Institute

Hsin-Hwa Chen

Chia-Ying Yen

Cheng-Chuan Wang

Cheng-Chou Wong

Hsien-Lin Hu

Hsiang-Cheng Kung

A lightning protection structure is provided, which includes an insulation bottom layer, a graphite layer on the insulation bottom layer, an insulation shell on the graphite layer, and an electrically conductive component. A part of the electrically conductive component is disposed on the insulation shell, and another part of the electrically conductive component is in contact with the graphite layer.

Lightning protection structure

An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

Electric conductive heat dissipation substrate

A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.

Growing community of inventors

Taipei, Taiwan

Hsin-Hwa Chen