Apple Inc.

Luxvue Technology Corporation

Other

Hsin-Hua Hu

Andreas Bibl

John A Higginson

Hung-Fai Stephen Law

Kapil Vinod Sakariya

Kelly C McGroddy

Clayton Ka Tsun Chan

Kevin K C Chang

Daniel Arthur Haeger

Andreas Bibi

Vaibhav D Patel

Xia Li

Imran Hashim

Shinya Ono

Ion Bita

Sunggu Kang

James E Pedder

Tore Nauta

Lun Tsai

Stephen Paul Bathurst

Jaein Choi

Jung Yen Huang

Hairong Tang

Edzer Huitema

Sandeep Chalasani

Chih-Lei Chen

Chin Wei Hsu

Ralph E Kauffman

Chien-Hsing Huang

Kelly Mcgroddy

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Light emitting device reflective bank structure

A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Display and micro device array for transfer to a display substrate

Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

Display with embedded pixel driver chips

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

Light emitting structure

Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

LED with internally confined current injection area

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Micro device transfer head assembly

A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

Micro device stabilization post

Growing community of inventors

Los Altos, CA, United States of America

Hsin-Hua Hu