Industrial Technology Research Institute

Hsin-Hsien Yeh

Hong-Ching Lin

Jiun-Jang Yu

Jing-Pin Pan

Yuh-Fwu Chou

Chiung-Hsiung Chen

Mo-Hua Yang

Lu-Chih Wang

Tsung-Wen Chen

Wen-Hao Deng

Jyh Ming Wu

Horng-Yuan Wen

Wei-Tsung Kao

Ying-Chang Hung

The disclosure provides a photocatalyst material and a method for fabricating the same. The photocatalyst material includes a zinc oxide material doped with metal, wherein the zinc oxide material has a lattice structure including a plurality of defects. A part of the defects are filled with a metal.

Photocatalyst material and method for fabricating the same

A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.

Protection component and protection device using the same

A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.

Wireless communication apparatus

A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.

RFID tag

The security system for a protected object comprises a first wireless module, a central controller, and a remote authorization server. The first wireless module and the central controller are disposed in the protected object. The first wireless module transmits an authorization request with an authorization ID (identification) of the protected object, and receives an authorization response. The central controller is coupled to the first wireless module, and allows the protected object to operate in accordance with the authorization response. The remote authorization server, responsive to the authorization request, generates the authorization response from an authorization record thereof in accordance with the authorization ID, and transmits the authorization response.

Security system

Growing community of inventors

Taichung, Taiwan

Hsin-Hsien Yeh