Unistars Corporation

Hsin-Hsien Hsieh

Shang-Yi Wu

An optoelectronic package includes a wiring substrate having a holding plane, an optoelectronic chip, a reflective material, an optical element and an adhesive. The optoelectronic chip is mounted on the holding plane and electrically connected to the wiring substrate. The optoelectronic chip has an upper surface, a functional region and a side surface connected to the upper surface. The reflective material is on the holding plane and surrounds the optoelectronic chip. The reflective material covers the side surface and has an inclined surface. The inclined surface surrounds the upper surface and extends from an edge of the upper surface. The height of the reflective material at the inclined surface decreases from the optoelectronic chip toward a direction away from the optoelectronic chip. The adhesive covers the reflective material and the upper surface and is connected between the optoelectronic chip and the optical element.

Optoelectronic package

An optoelectronic package includes a substrate, a light emitting chip, an optical sealant, and an optical scattering layer. The substrate has a carrying plane and a wiring layer formed on the carrying plane. The light emitting chip used for emitting a light ray is mounted on the carrying plane and electrically connected to the wiring layer. The optical sealant covers the carrying plane and wraps the light emitting chip. The optical sealant is located in the path of the light ray. The optical scattering layer covers the optical sealant. The optical sealant located in the path of the light ray is formed between the substrate and the optical scattering layer. Preferably, the refractive index of the optical sealant is larger than or equal to the refractive index of the optical scattering layer.

A light emitting device includes a carrier, a light emitting chip, and a covering part disposed on the carrier. The carrier includes a board, a guiding metal layer, and a sealing material. The board has a first surface, a second surface, and a through vent that is divided into a first partial hole and a second partial hole. The first partial hole extends from the first surface to the second partial hole, and the second partial hole extends from the second surface to the first partial hole. The guiding metal layer is formed on the second surface and in the second partial hole, and covers the sidewall of the second partial hole. The guiding metal layer extends from the second partial hole to the second surface, and does not cover the sidewall of the first partial hole and the first surface. The sealing material seals the second partial hole.

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Taoyuan, Taiwan

Hsin-Hsien Hsieh