Industrial Technology Research Institute

Embed Technology Co., Ltd.

Hsin-Herng Wang

Bin-Yuan Lin

Te-Yeu Su

Chia-Tin Chung

Wun-Ku Wang

Jian-Hong Chen

Wu-Bin Yuo

Wen-Jer Chen

Wen-Jeng Lin

Der-Tarng Su

Li-Chung Ping

Hsien-Mhing Chen

Ying-Ti Chu

Hsiao-Pin Huang

Hui-min Huang

Chin-Ming Chu

Wei-Chun Yang

Su-Jen Chang

The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10&#xb0; to 85&#xb0; to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.

Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances

A process is disclosed for forming resistors on a printed circuit substrate. The method includes the step of applying a photoresist layer onto substrate, and forming openings in the photoresist layer to expose the preselected regions for resistors, such that polymer thick resist pastes as well as resistive metallic films can be applied onto the substrate through these openings with precise geometry. The process according to the invention has higher accuracy and greater processing flexibility than the prior art processes where the resistor pastes are directly applied onto the substrate by screen printing.

Process for forming polymer thick film resistors and metal thin film resistors on a printed circuit substrate

A novel PTC conductive polymer composition is disclosed, which comprises (a) 35 to 60%, by weight of the composition, of a branched polyolefin with a polydispersity index of less than 2.5; and (b) 20 to 45%, by weight of the composition, of conductive particles which have been dispersed in the polyolefin. The PTC composition of the invention has intense, reproducible PTC behavior and is particularly suitable for use in PTC thermistors.

PTC conductive polymer composition

The present invention uses high molecular weight polyethene glycol copolymer with high antistatic property, and other solubilizer agent to proceed blending and enhancing the co-solublization property of the polyamide. The long-term antistatic plastic particles obtained by blending the modified antistatic composition and the polyamide material are made into different articles according to various composites. The molded articles are divided into three types: (1) an antistatic polyamide article with surface resistance of about 10.sup.10 -10.sup.11 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 1.5 sec; (2) an antistatic polyamide fiber with surface resistance of about 6.times.l0.sup.10 -1.2.times.10.sup.12 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 60 sec; (3) a polishing resistant antistatic polyamide with surface resistance of about 10.sup.10 -10.sup.11 (.OMEGA./sq.), and the dissipation time of electrostatic charge is less than 1.5 sec.

Long-term antistatic composition

Polymer thick film resistor pastes with dimensionally stability and excellent processibility, such as coating, printing, and extruding, are disclosed. The resistor paste composition in accordance with the present invention comprises a low-k cycloaliphatic epoxy resin vehicle loaded with electrically conductive particles, a cationic photoinitiator, a thermal catalyst, and optionally a reactive diluent.

Polymer thick film resistor pastes

Laminar articles having improved barrier properties to organic solvents and gases, fabricated directly from polyolefin and modified polyamide, are disclosed. The modified polyamide is a blend of 97-40 wt % polyamide and 3-60 wt % of compatabilizer which is a polyether ester amide block copolymer or a mixture of the block copolymer and alkylcarboxyl-substituted polyolefin.

Thermoplastic polyolefin resin composition and laminar articles having

A catalyst composition for use in the preparation of poly(butylene terephthalate) from dimethyl terephthalate, comprising: (a) a titanium compound primary catalyst, from about 0.01 PHR to about 1 PHR; and (b) an alkali metal phosphate or alkali metal phosphite co-catalyst, from about 0.001 PHR to about 1 PHR; wherein PHR represents parts of the primary catalyst or the co-catalyst per one hundred parts, by weight, of dimethyl terephthalate. Preferred titanium compounds include tetrabutyl titanate or tetra(isopropyl) titanate; the alkali metal phosphate can be a phosphate salt containing one, two, or three metal groups; and the alkali metal phosphite can be a phosphite salt containing one or two metal groups. With this catalyst composition, the transesterification rate was increased by 10 percent or more. Furthermore, the reaction product poly(butylene terephthalate) shows an increased intrinsic viscosity over those without the co-catalyst, indicating a greater degree of polymerization.

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Hsinchu, Taiwan

Hsin-Herng Wang