Innolux Corporation

Hsin-Hao Huang

Chu-Hong Lai

Yu-Chih Tseng

Chien-Feng Li

Ming-Han Wu

A manufacturing method of an electronic device is provided. First, a mother panel including a first flexible mother board, a second flexible mother board and at least one sealing material is provided, and the sealing material is disposed between the first flexible mother board and the second flexible mother board. Then, a separating process including a laser-cutting process is performed to cut the first flexible mother board into a first flexible substrate and to cut the second flexible mother board into a second flexible substrate. The first flexible substrate includes a first laser-cutting buffer region and a first edge. The second flexible substrate includes a second laser-cutting buffer region and a second edge. The sealing material is away from the first edge by the first laser-cutting buffer region and away from the second edge by the second laser-cutting buffer region.

Manufacturing method of electronic device

The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140&#xb0; C. and less than or equal to 165&#xb0; C.

Method for manufacturing flexible display device

The present disclosure provides an electronic device including a first flexible substrate, a second flexible substrate, a liquid crystal layer and a supporting structure. The second flexible substrate includes a first region and a second region. The first region overlaps with the first flexible substrate, and the second region does not overleap with the first flexible substrate. The liquid crystal layer is disposed between the first flexible substrate and the second flexible substrate. The supporting structure is disposed on the second region and includes a supporting film.

Electronic device

The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140&#xb0; C. and less than or equal to 165&#xb0; C.

Flexible display device and method for manufacturing thereof

An electronic device and a manufacturing method thereof are disclosed in the present disclosure. The electronic device comprises a first flexible substrate, a second flexible substrate and a sealing material. The first flexible substrate comprises a first laser-cutting buffer region, and the first flexible substrate comprises a first edge. The second flexible substrate comprises a second laser-cutting buffer region, and the second flexible substrate comprises a second edge. The sealing material is disposed between the first flexible substrate and the second flexible substrate. The sealing material is away from the first edge by the first laser-cutting buffer region and the sealing material is away from the second edge by the second laser-cutting buffer region. Therefore, the cracking of the sealing material can be reduced.

Growing community of inventors

Miao-Li County, Taiwan

Hsin-Hao Huang