Foxsemicon Integrated Technology, Inc.

Hsin-Fei Huang

Zheng-Jay Huang

Ying-Chieh Lu

Ping-Yu Chen

Chien-Ting Lu

Shan-Ju Lin

Yu-Pin Liu

Yu-Shu Chen

Kuo-Mang Lo

Chih-Ming Lai

Ming-Young Shiao

Wen-Jang Jiang

Kuo-Feng Chiang

Chih-Chung Tsao

Chi-Chung Hu

Nai-Wen Zhang

Ying-Ching Chen

A LED package includes a LED chip, a first phosphor layer, a second phosphor layer, a transparent adhesive and a lens. The lens includes an inner surface and an exterior surface. The first phosphor layer is mounted on the LED chip. The transparent adhesive is filled between the LED chip and the lens. The second phosphor layer is mounted on one of the inner surface and the exterior surface of the lens. Each of the first phosphor layer and the second phosphor layer is of one color.

LED package having lens, transparent adhesive and phosphor layers

A LED package includes a substrate, at least one LED chip, a transparent adhesive and a lens. The at least one LED chip is mounted on the substrate. The transparent adhesive is filled between the LED chip and the lens. A number of through holes is regularly defined in an optical non-effective portion of the lens. The through holes are configured for increasing the air convection between inside and outside of the lens.

Growing community of inventors

Miao-Li Hsien, Taiwan

Hsin-Fei Huang