Advanced Semiconductor Engineering, Inc.

Universal Scientific Industrial (shanghai) Co., Ltd.

Universal Global Scientific Industrial Co., Ltd.

Acer Communications and Multimedia Inc.

Hsin-Chin Chang

Jaw-Ming Ding

Jen-Chun Chen

Ben-Chuan Du

Chen-Huang Fan

Pai-Sheng Shih

Jia-Hong Mou

An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.

Electronic package module and method of manufacturing the same

A bandgap reference voltage generating circuit for providing a reference voltage is disclosed. The bandgap reference voltage generating circuit includes four-terminal current source circuit, a regulator circuit and a temperature-compensating circuit. The four-terminal current source circuit outputs a first voltage, a second voltage and a first current which are independent of variation of a first system voltage. The regulator circuit receives the first voltage and the second voltage and when the first system voltage is larger than a threshold voltage value, the regulator circuit outputs the reference voltage independent of variation of the first system voltage via voltage-difference between the first voltage and the second voltage. The temperature-compensating circuit receives the first current and compensates a temperature curve of the reference voltage outputted from the regulator circuit.

Bandgap reference voltage generating circuit and electronic system using the same

An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.

Electronic module and method for same

A radio frequency (RF) amplifier is disclosed. The RF power amplifier includes a bias circuit, an output-stage circuit and a RF compensation circuit. When a first system voltage is larger than a first voltage threshold value, the bias circuit generates a first current rising slightly. When first system voltage is larger than second voltage threshold value, the RF compensation circuit receives a second circuit rising slightly transmitted from the bias circuit. When the first system voltage is in an operation voltage range, the first current is larger than the second circuit so as to a quiescent operating current of the RF power amplifier is independent of change of the first system voltage. When the first system voltage is larger than a third voltage threshold value, the first current is equal to the second current so as to have the bias current being a zero current to protect the RF power amplifier from over-voltage.

Radio frequency power amplifier and electronic system

A portable electronic device with power failure recovery, powered by a main power source, the device comprising a power detection module, a processor, a timing unit and a power management unit. The power detection module detects an output characteristic from the main power source and asserts an interrupt signal if the characteristic is below a threshold value. The processor asserts a turn-off signal and an enable signal in response to the interrupt signal. The timing unit asserts a notification signal at a predetermined time interval when the enable signal is asserted. Upon receipt of the turn-off signal, the power management unit disconnects the main power source from a circuit block. Moreover, the power management unit reconnects the main power source to the circuit block when the notification signal is asserted and the output characteristic of the main power source is beyond the threshold value.

Growing community of inventors

Taipei, Taiwan

Hsin-Chin Chang