Asustek Computer Inc.

Compal Electronics, Inc.

Hsin-An Shu

Min-Hua Lin

Hsin-Yi Wu

Hui-Lian Chang

Ming-Wang Lin

Pan-Jen Chen

Jui-Huang Weng

Jia-Rung Tsai

Yi-Hsiang Hung

The disclosure provides a surface treatment method which is suitable for a metal substrate. The metal substrate has an appearance surface. The surface treatment method comprises the following steps: first, applying surface sandblasting treatment to an appearance surface to form a sandblasted surface; subsequently, applying micro-arc oxidation treatment to the sandblasted surface in combination with an electrolytic solution to form a micro-arc oxidized surface; and then forming a coating to cover the micro-arc oxidized surface; wherein, the components of the electrolytic solution comprise sodium phosphate, sodium silicate, sodium aluminate, potassium fluoride, potassium hydroxide, ammonium vanadate, potassium vanadate, disodium ethylenediaminetetraacetic acid (NaEDTA) and sodium tetraborate.

Surface treatment method

An electronic apparatus includes a casing, a fan module, and at least one reinforcing structure. The casing includes a lateral side. The fan module is located in the casing. The reinforcing structure is located in the casing and between the lateral side and the fan module, and the reinforcing structure serves to enhance the support strength of the casing between the lateral side and the fan module.

Electronic device having fan module with reinforcing structure

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Taipei, Taiwan

Hsin-An Shu