Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsin-An Shen

Chien-Hsun Lee

Chih-Hang Tung

Da-Yuan Shih

Ming-Chung Sung

Yung Ching Chen

Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.

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Hsin-Chu, Taiwan

Hsin-An Shen