Ansys, Inc.

Hsiming Pan

Norman H Chang

Deqi Zhu

Jimin Wen

Akhilesh Kumar

Wen-Tze Chuang

Ying-Shiun Li

En-Cih Yang

Wenbo Xia

Karthik Srinivasan

Zhigang Feng

Lang Lin

Dinesh Kumar Selvakumaran

Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network. The trained predictor can be used to determine a temperature rise and then can be appended to a system level thermal profile of the IC to generate a detailed thermal profile of the IC.

Systems and methods for machine learning based fast static thermal solver

Methods, machine readable media and systems for a method to determine if a model of an integrated circuit (IC) includes a Trojan component are described. In one embodiment, a method can include the following operations: splitting the model of the IC into a plurality of tiles; simulating the IC with an elevated temperature of each tile to predetermined level; computing a temperature-dependent leakage power for each tile; and identifying a tile of the IC as including a Trojan component based on the temperature-dependent leakage power computed.

Systems and methods for a comprehensive and efficient simulation-based methodology on IP authentication and trojan detection

Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. The methods can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC); performing a thermal simulation for each respective template of the IC based on a sequence of power patterns of tiles of the respective template; and training a neural network with a plurality of training data collected via thermal simulations performed for the templates of the IC. These systems and methods can use a machine learning predictor, that has been trained to determine a transient temperature rise across an entire IC, and then append the determined transient temperature rise to a system level thermal profile of the IC.

Predicting on chip transient thermal response in a multi-chip system using an RNN-based predictor

Data is received that characterizes a chip in the package system (CPS) having a plurality of wires and vias. Thereafter, using the received data, a chip power calculation is performed. The chip power calculated is used to generate a thermal-aware power map. Further, package and system level thermal analysis is performed using the power map to generate a tile-based CPS thermal profile. A plurality of chip finite element sub-models are then generated that each correspond to a different tile. A thermal field solution is solved for each sub-model so that, for each wire, wire temperature rises are extracted from the corresponding the chip sub-model analysis and combined with temperature values from the CPS thermal profile. This extracting and combining is then used to generate a back-annotation file covering each metal wire and via in the CPS.

Calculating and extracting Joule-heating and self-heat induced temperature on wire segments for chip reliability

Calculating and extracting joule-heating and self-heat induced temperature on wire segments for chip reliability

Systems and methods are provided for estimating a temperature of a wire of an integrated circuit (IC) chip having a plurality of heat-generating components. For each of the heat-generating components, a temperature of the heat-generating component is computed. For each of the heat-generating components, a decay profile defining a thermal coupling from the heat-generating component to wires of the IC chip is computed. For each of the heat-generating components, a temperature elevation on the wire caused by the heat-generating component is computed. The temperature elevation is computed based on the temperature and decay profile of the heat-generating component and a spatial relationship between the wire and the heat-generating component. A total temperature elevation on the wire is computed by summing the temperature elevation of each of the heat-generating components. The heat-generating components include a plurality of wires of the IC chip and at least one device of the IC chip.

Systems and methods for estimating temperatures of wires in an integrated circuit chip

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San Jose, CA, United States of America

Hsiming Pan