Ultra Display Technology Corp.

Lg Display Co., Ltd.

Panelsemi Corporation

Hsien-Te Chen

An electronic device comprises a target substrate, a micro semiconductor structure array, a conductor array, and a connection layer. The micro semiconductor structure array is disposed on the target substrate. The conductor array corresponds to the micro semiconductor structure array, and electrically connects the micro semiconductor structure array to a pattern circuit of the target substrate. The conductors of the conductor array are independent from one another. Each conductor is an integrated member formed by eutectic bonding a conductive pad of the target substrate and a conductive electrode of the corresponding one of the micro semiconductor structures of the micro semiconductor structure array. The connection layer connects the micro semiconductor structures to the target substrate. The connection layer excludes a conductive material. The connection layer contacts and surrounds the conductors, so that the connection layer and the conductors together form a one-layer structure.

Electronic device

An electronic detection system includes an electronic device, a detector and a memory. The electronic device includes a circuit substrate, a plurality of photoelectric components, and a plurality of tunable current source circuits. Each photoelectric component has one or more peak emission wavelengths in response to a plurality of current values. The tunable current source circuits are disposed on the circuit substrate and electrically connected to the photoelectric components. The detector captures a feature value of a corresponding one of the photoelectric components. One or more lookup tables stored in the memory are based on the feature values and the current values of the photoelectric components. Each tunable current source circuit transmits an input current to a corresponding one of the photoelectric components in response to the lookup table(s) to perform a selected peak emission wavelength.

Electronic detection system

An antenna device includes a substrate and a plurality of antenna elements arranged in an array. The substrate has a driving circuit. The driving circuit defines a frame rate N and a refresh time, wherein the sum of N refresh times is 1 second. The antenna elements are arranged on the substrate and are electrically connected to the driving circuit. The antenna elements jointly define a beamforming in each refresh time (1/N second), and the beamforming defines a signal, which includes a carrier frequency that is not less than 10 GHz and a characteristic information for communicating with a satellite. M consecutive beamformings contain two or more kinds of the characteristic information, wherein M is an integer not greater than 20.

Antenna device

A luminance compensation method of a light-emitting device is disclosed. The light-emitting device has a plurality of light-emitting elements. The luminance compensation method includes following steps of: obtaining a position of at least one of the light-emitting elements in a brightness anomalous status; and changing a brightness of at least one of the light-emitting elements disposed adjacent to the light-emitting element in the brightness anomalous status for compensating a brightness of the light-emitting elements in the brightness anomalous status.

Luminance compensation method of light-emitting device

An antenna device includes a first substrate, plural antenna elements, a second substrate, plural circuit units, plural circuit patterned layers and plural conductive structures. The first substrate is defined with a first surface and a second surface opposite to each other. The antenna elements are arranged on the first surface of the first substrate. The second substrate is connected to the second surface of the first substrate. The circuit units are arranged at the second substrate. The circuit patterned layers are arranged on the first substrate and the second substrate. The conductive structures are connected to at least ones of the circuit patterned layers. One of the circuit patterned layers includes plural induction units corresponding to the antenna elements, at least ones of the circuit units correspond to the induction units, and the induction units and the antenna elements transmit a carrier signal to each other by electromagnetic induction.

An electronic device includes a substrate, plural varactors, a memory element, a driving unit and plural antenna elements. Each varactor is defined with a capacitor-voltage characteristic curve. The memory element is defined with one or more lookup tables for recording the capacitance values and varactor voltage values of the capacitor-voltage characteristic curve. The driving unit outputs plural voltage signals respectively to the varactors, and each voltage signal respectively provided with one varactor voltage value. Each antenna element is provided with various phase values in response to the capacitance values of the corresponding varactor. A selective one of the varactor voltage values in response to the required capacitance value of the corresponding varactor is found out from the lookup table(s) and delivered by the driving unit. The antenna elements are together enabled to form a wave beam with a characteristic wavefront in accordance with the capacitance values.

An electronic device may include: a display panel comprising a pixel flexible substrate, a driving circuit, a display medium formed from an organic light-emitting material, and a plurality of shielding units; and a plurality of micro photoelectric units adjacent to a protection layer and away from the display panel. The plurality of micro-photoelectric units may comprise respective micro-photoelectric elements, and at least one of the micro-photoelectric elements may be, or may include, a sensor element. The protection layer may serve to protect the plurality of micro-photoelectric units while being located at one side of the plurality of micro-photoelectric units. Each of the plurality of micro photoelectric units may be configured to emit light toward an object, and to receive the light reflected, scattered, refracted, or diffracted by, or penetrating through, the object, or receive a signal generated from the light after being reflected, scattered, refracted, or diffracted by, or penetrating through, the object.

Electronic device with micro-photoelectric units

An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units through a conductive pad. Each of the resilient conductive pillars is a conductive photoresist.

Electronic detection interface and electronic detection module using the same

An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit layer, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units. Each of the resilient conductive pillars comprises a non-conductive photoresist and a conductive layer entirely covering the non-conductive photoresist.

An electronic device includes a substrate, a plurality of micro semiconductor structure, a plurality of conductive members, and a non-conductive portion. The substrate has a first surface and a second surface opposite to each other. The micro semiconductor structures are distributed on the first surface of the substrate. The conductive members electrically connect the micro semiconductor structures to the substrate. Each conductive member is defined by an electrode of one of the micro semiconductor structures and a corresponding conductive pad on the substrate. The non-conductive portion is arranged on the first surface of the substrate. The non-conductive portion includes one or more non-conductive members, and the one or more non-conductive members are attached to the corresponding one or more conductive members of the one or more micro conductive structures.

An image detector includes a substrate, a circuit layer, a plurality of light detecting elements, a plurality of driving elements and a crystal scintillation layer. The substrate has a surface. The circuit layer is arranged on the surface of the substrate, and defines a plurality of detecting areas arranged in an array. The light detecting elements and the driving elements are disposed at the detecting areas and electrically connected with the circuit layer. Each driving element drives one or more of the light detecting elements. The crystal scintillation layer is arranged opposite to the substrate and covers the detecting areas. The light detecting elements and the driving elements connect with the surface of the substrate. At least one of the light detecting elements and the driving elements is formed by a process different from the process of forming the circuit layer on the substrate.

Micro image detector

An electronic device includes a first module and a second module stacked upon the first module in a stacking direction. The first module includes a pixel substrate and a counter substrate disposed opposite to each other. The pixel substrate is defined with a plurality of pixels. The second module is disposed at one side of the first module adjacent to the counter substrate and away from the pixel substrate. The second module includes a plurality of micro-photoelectric units and a protection layer. The protection layer stacks upon the micro-photoelectric units and is disposed at one side of the second module away from the first module. Each of the micro-photoelectric units unshields one or more of the pixels in the stacking direction. Each micro-photoelectric unit includes a micro-photoelectric element, and at least one of the micro-photoelectric elements is a sensor element.

Electrical device with micro-photoelectric units

An electronic detection interface comprises a substrate structure and a plurality of detection units in array. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units.

Electronic detection module for testing micro chips

A photoelectric device includes a target substrate, a circuit pattern layer disposed on the target substrate, a plurality of micro photoelectric elements electrically connected to the circuit pattern layer, and a supplemental repair element electrically connected to the circuit pattern layer. The target substrate is configured with a plurality of connection positions and a repair position disposed with an offset with relative to a corresponding one of the connection positions. The offset is greater than or equal to zero. The micro photoelectric elements are individually disposed on at least a part of the connection positions of the target substrate. The supplemental repair element has an electrode disposed on the repair position of the target substrate, and the electrode is connected to the circuit pattern layer. On the target substrate, the supplemental repair element is arbitrary with respect to the micro photoelectric elements.

Growing community of inventors

Taipei, Taiwan

Hsien-Te Chen