Massachusetts Institute of Technology

The Trustees of Boston College

Gmz Energy, Inc.

Hsien-Ping Feng

Zhifeng Ren

Gang Paul Chen

Shuo Chen

Bed Poudel

Yu Bo

Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Metal deposition using seed layers

Growing community of inventors

Watertown, MA, United States of America

Hsien-Ping Feng