Industrial Technology Research Institute

National Science Council of Republic of China

Hsien-Kuang Lin

Man-Lin Chen

Sue-May Chen

Jim-Chyuan Shieh

Dhei-Jhai Lin

Jauder Jeng

Su-Huey Chen

Pao-Ju Hsieh

Tien-Shou Shieh

Chao-Wen Niu

Yu-Lin Liu

Der-Jaw Chan

Jing-Pin Pan

Shur-Fen Liu

Mei-Rurng Tseng

Hua-Chi Cheng

Te-Yi Chang

Tsung-Yi Chou

Chi-Fu Tseng

Chun-Neng Ku

Jong-Min Liu

Juen-Kai Wang

Wen-Kuo Weng

Shou-An Chen

Chuang-Shin Chiou

Pey-Ching Liou

Pa-Yen Lu

Hwa-Chi Cheng

Chao-Huei Tseng

Ming-Hsueh Chiang

A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r, wherein r<r≤0.8 and r−r≥0.025.

Double-sided optically clear adhesive and multilayer structure including the same

A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.

Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the same

A wood adhesive is provided. The wood adhesive includes a first agent and a second agent. The first agent includes a sodium carboxymethyl cellulose and a styrene-butadiene rubber polymer. The sodium carboxymethyl cellulose has a molecular weight between 15,000 and 500,000 and a degree of substitution of from 0.4 to 2.00 of the sodium salt. The second agent includes a polymeric quaternary amine.

Wood adhesive

A hardcoat composition and a polarizer and a display device applying the same are provided. The hardcoat composition includes an acrylic copolymer, a multi-functional unsaturated photomonomer or oligomer, a photoinitiator, and a thermal curing agent. The acrylic copolymer with hydroxyl group has a weight-average molecular weight equal to or larger than 15,000 and has a glass transition temperature higher than 25&#xb0; C.

Hardcoat composition and polarizer and display device applying the same

A method of forming a biomass photosensitive material is provided, which includes () polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and () mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

Biomass photosensitive material and method for manufacturing the same, and printed circuit board

A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition includes a binder agent, a first photomonomer, and a photo initiator. The first photomonomer has at least a lactic oligomer and at least two unsaturated acrylic functional groups, wherein the first photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photoinitiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

Photosensitive composition and photoresist

A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition comprises a binder agent, a photomonomer and a photoinitiator. The binder agent has a chemical structure comprising following repeating unit: Ris H or CH, n is 2-40 of integer. The photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photo initiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

An organic electroluminescent device. The device has an organic electroluminescent light recovery layer consisting of dielectric material and nanoscale metal particles or organic material and nanoscale metal particles. The membrane of the organic electroluminescent light recovery layer cross couples with surface plasmon resonance and recovers light trapped in the device, enhancing the light emission efficiency of the organic electroluminescent device.

Organic electroluminescent device with a nanostructured recovery layer

Fabrication device of organic light emitting diode (OLED) includes a Substrate, a transparent conductive layer, an insulating film layer, an organic light-emitting layer, and a conductive layer; when a suitable potential is applied thereto, an organic light-emitting layer emits a visible light, however, it usually occurs breakdown between cathode and anode or bad signal, therefore, the present invention provides a positive insulating film photoresist with an easily inclining obtuse angle, smooth surface, and easily controlled fabrication condition to cover the edge of a transparent electrode (anode) in order to avoid that when the edge of ITO transparent electrode is sharp it causes an organic light-emitting layer film breakdown and results from signal lost or weaken to increase the yields.

Photosensitive insulating film of organic light emitting diode (OLED)

The invention discloses a method of forming via-holes in multilayer circuit boards. The process includes forming covering substances in predetermined spots in a multilayer circuit board and thereafter applying an insulating layer upon the circuit board. The predetermined spots are then uncovered and the covering substances are removed to form via-holes.

Method of forming via-holes in multilayer circuit boards

The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

Photosensitive composition

A photosensitive composition is disclosed particularly for making printed circuit boards. It contains: (a) a polymer binder; (b) a photoinitiator; and (c) an unsaturated photomonomer. The polymer binder is prepared from a reaction among the following reactants: (i) a styrene-maleic anhydride resin containing repeating units of styrene and anhydride groups, (ii) an unsaturated compound containing at least one hydroxy group and at least three acrylic groups, and (iii) a saturated alcohol. The styrene-maleic anhydride resin is prepared from a polymerization reaction of styrene and maleic anhydride in a molar ratio ranging from 3:1 to 1:1, and preferably has a molecular weight between 800 and 100,000.

Negative-type photosensitive composition

The invention relates to a water-soluble self-acid-doped polyaniline derivatives and in particular, to a water-soluble self-acid-doped polyaniline derivatives obtained by reacting polyaniline derivatives with 2-sulfobenzoic anhydride derivatives, which is composed of structural unit having following formula (I): ##STR1## wherein, M may be H, Na, K or NH.sub.4 ;

Water-soluble self-acid-doped polyaniline derivatives and process for

An improved method for making color filter plates from anionic electrocoats is disclosed. It comprises the steps of: (a) forming a positive photoresist layer on an electrically conductive transparent glass substrate; (b) exposing the portions of the glass substrate to be electrodeposited with a designated color electrocoat by removing corresponding portions of the positive photoresist layer using a photomasked light exposure procedure followed by a development procedure with a developer solution; (c) electrodepositing the designated color electrocoat on the exposed portions of the glass substrate; (d) performing a flood exposure on remaining portions of the positive photoresist; (e) performing a postbake procedure by heating the glass substrateto thereby harden the color electrocoat; (f) using a basic developer solution to remove the remaining portions of the positive photoresist; and (g) repeating steps (a) through (f) until all the desired electrocoats are electrodeposited on the glass substrate. The flood exposure step causes the photoresist to undergo a chemical reaction so that it will not crosslink during the postbake step and thus can be readily removed in step (f).

Growing community of inventors

Hsinchu, Taiwan

Hsien-Kuang Lin