Infineon Technologies Ag

Infineon Technologies Austria Ag

Hsieh Ting Kuek

Chau Fatt Chiang

Ralf Otremba

Edward Fuergut

Teck Sim Lee

Kok Yau Chua

Lee Shuang Wang

Stefan Helmut Schmalzl

Sanjay Kumar Murugan

Werner Josef Reiss

Christian Kasztelan

Chee Hong Lee

Soon Lee Liew

Hock Heng Chong

Nurfarena Othman

Pei Luan Pok

Roslie Saini Bin Bakar

April Coleen Tuazon Bernardez

Junny Abdul Wahid

Kon Hoe Chin

Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.

Semiconductor package with air cavity

An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.

Functionalized interface structure

A method of manufacturing a semiconductor package includes providing a carrier, forming a post slot and a terminal slot in the carrier, depositing a post in the post slot, depositing a terminal in the terminal slot, forming an encapsulant slot in the carrier, wherein the post extends into and is located within a periphery of the encapsulant slot and the terminal extends into the encapsulant slot, mechanically attaching a semiconductor chip to the post, electrically connecting the chip to the terminal, depositing an encapsulant in the encapsulant slot, and removing the carrier from the terminal.

Method of manufacturing a semiconductor package using a carrier

Growing community of inventors

Melaka, Malaysia

Hsieh Ting Kuek