Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsiao-Yun Chen

Chen-Hua Douglas Yu

Chih-Hang Tung

Tung-Liang Shao

Yi-Li Hsiao

Su-Chun Yang

Da-Yuan Shih

Chung-Jung Wu

Wen-Lin Shih

Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a device includes coupling a first semiconductor device to a second semiconductor device by spacers. The first semiconductor device has first contact pads disposed thereon, and the second semiconductor device has second contact pads disposed thereon. The method includes forming an immersion interconnection between the first contact pads of the first semiconductor device and the second contact pads of the second semiconductor device.

Immersion interconnections for semiconductor devices and methods of manufacture thereof

A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

Multi-strike process for bonding packages and the packages thereof

A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn&#x2014;Bi compound, and the eutectic Sn&#x2014;Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90&#xb0;. The method further includes cooling down the solder bump.

Solder bump stretching method for forming a solder bump joint in a device

Multi-strike process for bonding

A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down to form a solder bump joint in an electrical device.

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Hsin-Chu, Taiwan

Hsiao-Yun Chen