Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Hongqisheng Precision Electronics (qinhuangdao) Co., Ltd.

Hsiao-Ting Hsu

Ming-Jaan Ho

Fu-Yun Shen

Xian-Qin Hu

Cong Lei

Yong-Chao Wei

Lin-Jie Gao

Li-Kun Liu

Fu-Wei Zhong

Tao-Ming Liao

Hong-yan Guo

Katsumi Fujiwara

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

Heat equalization plate

A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.

Pressure sensing circuit board and method for manufacturing the same

A covering film () includes a first covering layer (), a first adhesive layer (), and a thermal conductive layer () sandwiched between the first covering layer () and the first adhesive layer (). A thermal conductivity of the thermal conductive layer () is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer () is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer () is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.

Covering film, and circuit board and manufacturing method

A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

Circuit board with heat dissipation structure and method for manufacturing same

A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (), a second circuit board (), at least one third circuit board (), a fourth circuit board (), a fifth circuit board (), and a sixth circuit board (); stacking the first circuit board (), the second circuit board (), and third circuit board () in that order, and stacking the fourth circuit board (), the sixth circuit board (), and the fifth circuit board () on the third circuit board (), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Circuit board for transmitting high-frequency signal and method for manufacturing the same

A method for manufacturing a circuit board () includes: providing a first single-sided circuit substrate () including an insulating base layer () and a circuit layer (); forming first conductive posts () electrically connected to the circuit layer () in the insulating base layer () to obtain a second single-sided circuit substrate (); providing a first adhesive layer (), forming second conductive posts (); providing one second single-sided circuit substrate (), defining a receiving groove () to obtain a third single-sided circuit substrate (); providing another first single-sided circuit substrate (), mounting an electronic component () on the circuit layer () to obtain a surface mounted circuit substrate (); stacking the first single-sided circuit substrate (), the first adhesive layer (), the second single-sided circuit substrate (), at least one of the third single-sided circuit substrate (), and the surface mounted circuit substrate () in that order; pressing the intermediate body ().

Circuit board with embedded electronic component and method for manufacturing the same

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber. The present invention also needs to provide a method for manufacturing the heat equalization plate.

Heat equalization plate and method for manufacturing the same

A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Circuit board and manufacturing method thereof

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Method of manufacturing circuit board

A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.

Flexible battery assembly and method for manufacturing the same

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

Method for making a heat dissipation structure

A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place.

Electromagnetic shielding film

The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.

Transparent PCB and method for manufacturing the same

A method for fabricating a sandwiched structure of silver-copper-silver functioning as a high frequency signal transmission structure includes an insulating sheet and a conductive circuit on the insulating sheet. The conductive circuit includes a silver conductive layer bonded to the insulating sheet, a copper conductive layer formed on the silver conductive layer, and a silver covering layer laid to cover top and side surfaces of the copper conductive layer. The silver conductive layer and the silver covering layer together enclose the copper conductive layer and the higher conductivity of the silver together with the skin effect improves high-frequency transmission efficiency of the copper.

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Taipei, Taiwan

Hsiao-Ting Hsu