Industrial Technology Research Institute

Cvitek Co. Ltd.

Icp Technology Co., Ltd.

Win-house Electronic Co., Ltd.

Hsiao-Ming Chang

Tao-Chih Chang

Jing-Yao Chang

Kuo-Shu Kao

Chih-Ming Shen

Chih-Ming Tzeng

Fang-Jun Leu

Ho-Chieh Yu

Hsin-Han Lin

Jen-Shi Wu

Chun-Yu Lin

Chen-Cheng-Lung Liao

Tsung-Hsien Lin

An encryption and signature device for AI model protection is provided. The encryption and signature device for AI model protection includes a key derivation unit, a model encryption unit, a model password encryption unit, an image generation unit and a signature unit. The key derivation unit is configured to derive a model key according to a model password and a derivation function. The model encryption unit is configured to encrypt an AI model according to the model key to generate an encrypted AI model. The model password encryption unit is configured to encrypt the model password to generate an encrypted model password. The image generation unit is configured to generate an image file according to the encrypted model password and the encrypted AI model. The signature unit is configured to sign the image file according to a private key to obtain a signed image file.

Methods and devices for AI model integrity and secrecy protection

A ceramic substrate component suitable for high-power chips includes a ceramic substrate body and at least one raised metal pad. The ceramic substrate body has an upper surface and a lower surface opposite to the upper surface. The raised metal pad includes a base portion and a top layer. The base portion, which is attached to the upper surface of the ceramic substrate body, has a thickness between 10 and 300 micrometers, and a thermal expansion coefficient greater than the ceramic substrate body. The top layer is formed on the base portion and adapted to install a high-power chip thereon. The top layer extends an area less than the base portion but greater than the high-power chip, and has a thermal expansion coefficient greater than the ceramic substrate body. As such, damages due to thermal stress occurring between the base portion and the ceramic substrate body can be mitigated.

Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component

A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.

Semiconductor package structure

Growing community of inventors

Taipei, Taiwan

Hsiao-Ming Chang