Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsiao-Lan Yeh

Jo-Fei Wang

Tsun-Ching Lin

Chang-Chu Yao

Chang Chu Yao

Gey-Fung Wei

A number of air actuated valves are added to a conventional apparatus for treating semiconductor wafers with HMDS, hexamethyl-disilazane, vapor to improve the adhesion between the wafers and resist layers. These valves allow for automatic purging of the HMDS vapor from the pipes in the apparatus by dry nitrogen thereby preventing HMDS vapor condensation in the pipes which leads to contamination of the HMDS supply. The valve system prevents any backstreaming of nitrogen gas into the HMDS supply tank.

Method and apparatus for automatic purge of HMDS vapor piping

A method and apparatus for cleaning a spray stream nozzle employed in dispensing upon a photoexposed blanket photoresist layer formed over a semiconductor substrate a photoresist developer solution. There is first provided a spray stream nozzle having a minimum of one aperture formed therein. There is then provided through the spray stream nozzle a volume of a photoresist developer solution sufficient to develop a photoexposed blanket photoresist layer formed over a semiconductor substrate placed beneath the spray stream nozzle. Finally, there is provided then through the spray stream nozzle a volume of a solvent which is not susceptible to clogging the spray stream nozzle.

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Hsin-Chu, Taiwan

Hsiao-Lan Yeh