Quanta Computer Incorporated

Hsiao-Fan Chang

Chi-Hsueh Yang

Ming-Chang Tsai

Wei-Han Chen

A fan structure includes a first fixing ring and a plurality of fan blades. The first fixing ring includes a plurality of first recesses radially arranged on the first fixing ring. One side of the fan blades is coupled to the first recesses of the first fixing ring. The first fixing ring includes a stamped part and a non-stamped part, in which the stamped part is in contact with the fan blades, and the thickness of the stamped part is smaller to the thickness of the non-stamped part.

Fan structure and manufacturing method thereof

A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.

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Taoyuan, Taiwan

Hsiao-Fan Chang