Super Micro Computer, Inc.

Chief Land Electronic Co., Ltd.

Hsiao-Chung Chen

Chung-Nan Pao

Po-Shen Chen

Yu-Chuan Chang

Yu-Hsiung Lin

Chia-Wei Chen

Yueh-Ming Liu

Kun-Chieh Liao

Chin-Hsiang Chou

Chia-Che Chang

Yu-Hsiang Huang

Hua-Kai Tong

Tan-Hsin Chang

Yu-Yen Hsiung

Ming-Yu Chen

A fluid immersion cooling system has a fluid tank containing a hydrocarbon dielectric fluid as a coolant fluid. One or more components of an electronic system is immersed in the coolant fluid. A gas cylinder contains a non-flammable, compressed filling gas. The temperature of the coolant fluid is monitored during operation of the electronic system. The filling gas is released from the gas cylinder and into the fluid tank when the temperature of the coolant fluid rises to a trigger temperature that is set based on the flash point of the coolant fluid. The filling gas covers a surface of the coolant fluid to block oxygen from interacting with vapors of the coolant fluid to prevent combustion.

Fluid immersion cooling system with low flash point hydrocarbon dielectric fluid

An electrical connector includes a housing and a plurality of terminal wafers. The housing is formed with a plurality of terminal slots along a traverse direction. The terminal wafers are contiguous to each other and retained in the housing. Each terminal wafer has a first terminal, a second terminal and a packaging body. The first terminal has a first contacting section, a first soldering portion and a first embedded section. The second terminal has a second contacting section, a second soldering portion and a second embedded section. The first and second contacting sections are extended along a plugging direction into one corresponding terminal slot. The packaging body wraps the first and second embedded sections. A curve contour of the first embedded section is corresponded to a curve contour of the second embedded section, so that an attachment relationship is configured with substantial identical distance therebetween.

Electrical connector having terminals embedded in a packaging body

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Taipei, Taiwan

Hsiao-Chung Chen