Accton Technology Corporation

Hsiao-Chien Chou

I-Ru Liu

Wen-Pin Lo

Ting-I Tsai

Tung-Kai Chang

Ming-Yi Shen

A wireless transceiver module has a plurality of through holes and includes a wireless network chip, a circuit substrate, a Bluetooth chip, and a plurality of conductive connection structures. The Bluetooth chip is disposed between the circuit substrate and the wireless network chip, and the through holes are formed by passing through the wireless network chip, the circuit substrate, and the Bluetooth chip. The conductive connection structures are respectively disposed in the through hole. With the conductive connection structures, the Bluetooth chip, the wireless network chip, and the circuit substrate are electrically connected with each another.

Growing community of inventors

Taiwan, Taiwan

Hsiao-Chien Chou