Industrial Technology Research Institute

Mektec Corporation

Hsiao-Chian Li

Fan-Jeng Tsai

Yeong-Tsyr Hwang

Tseng-Young Tseng

Chen-Ann Huang

An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

Preolymerizing epoxy resin, functionalized rubber with filler to form

A water-borne polyurethane modified cement composition is prepared from a dispersion of a water-dispersible polyurethane, a cross-linking agent, which is a polycarbodimide having N.dbd.C.dbd.N functional groups, and cement. Optionally, a water-reducing agent, and a surfactant can be added. The modified cement composition has higher tensile strength, elongation, and water resistance.

Growing community of inventors

Hsinchu, Taiwan

Hsiao-Chian Li