Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Wuhan China Star Optoelectronics Technology Co., Ltd.

Hsianglun Hsu

Jiangjiang Jin

Tianfu Guo

Jinchang Huang

Yu Gu

Jing Huang

Ming Zhang

Cunjun Xia

Simin Peng

Jun Cao

Kan Wang

Junyuan Wang

Hongyang Ren

An organic light-emitting diode device and a manufacturing method thereof are provided. The organic light-emitting diode device includes an array substrate, a light-emitting layer and a thin-film encapsulation layer stacked in order from bottom to top. The thin-film encapsulation layer includes a first inorganic layer, an organic layer and at least one dielectric structure layer in a stack. There is the dielectric structure layer is disposed in the thin-film encapsulation layer.

Organic light-emitting diode device with an array substrate and manufacturing method thereof

A display panel and a manufacturing method thereof are provided. The display panel includes an array substrate, a light emitting device layer, and an encapsulation layer. The encapsulation layer includes at least one first adhesive layer, and an orthographic projection of the at least one first adhesive layer on the array substrate is positioned in the array substrate.

Display panel and manufacturing method thereof

A composite film layer, a method for manufacturing the same, and a method for manufacturing an organic light emitting diode (OLED) display panel are provided. The composite film layer includes first sub-film layers and second sub-film layers having different refractive indices, wherein the first sub-film layers and the second sub-film layers are alternately stacked, and thicknesses of the first sub-film layer and thicknesses of the second sub-film layer gradually increase or decrease in a direction perpendicular to the composite film layer.

Composite film layer, having alternately-stacked sub-film layers with different refractive indexes

An organic light-emitting diode (OLED) panel is provided. The OLED panel includes: a substrate having a light emitting region and a non-light emitting region; and an organic flat layer, an anode, a first pixel definition layer, a light emitting layer, a cathode and an encapsulation layer stacked on the substrate. On the non-light emitting region, a second pixel definition layer is further disposed between the first pixel definition layer and the encapsulation layer, and is disposed adjacent to a cutting location of the OLED panellight emitting layer; and the second pixel definition layer is constructed as inverted trapezoidal structures spaced apart from each other.

OLED panel and display device thereof

The present invention provides an OLED display device, comprising: an OLED display panel, the OLED display panel comprising a display area and non-display areas in the both-ends edges of the display area; a dam unit and a film packaging layer. A part of the film packaging layer corresponding to the display area is disposed on the surface of the OLED display panel; another part of the film packaging layer corresponding to the non-display area is disposed on the surface of the dam unit; wherein, the dam unit comprises a flattening layer, a pixel isolation layer and a pixel support layer stacked-up together.

OLED display device

A flexible organic light-emitting diode (OLED) display and a method for manufacturing the same are provided. The method includes: forming an organic light-emitting display layer on a flexible substrate; coating a nanocomposite material on the organic emitting display layer to form a nanocomposite layer; and forming a first inorganic layer on the nanocomposite layer. The nanocomposite material is obtained by modifying surfaces of a plurality of nanoparticles with oleyl phosphate and then dispersing the modified nanoparticles in an organic monomer.

Flexible OLED display and method for manufacturing the same

An encapsulation method of an organic light emitting diode (OLED) device is provided. The encapsulation method includes steps of a substrate formed with the OLED device; forming at least an encapsulation film on a surface of the OLED device; and bonding a pre-formed barrier layer to an edge region of the encapsulation film. By bonding the pre-formed barrier layer to the edge region of the encapsulation film, the disclosure can achieve effects of improving an ability of moisture and oxygen resistance of the edge region of the OLED device, thereby improving reliability of encapsulation of the OLED device and prolonging lifetime of the OLED device.

Encapsulation method of organic light emitting diode device and encapsulation structure encapsulated using same

The present invention provides an encapsulation thin-film, including a first inorganic layer composed of a first oxide; a polymer layer disposed on the first inorganic layer, and composed of a polymer bonded to the first oxide by a chemical bond; and a second inorganic layer disposed on the polymer layer, and bonded to the polymer by a chemical bond. The encapsulation thin-film and the display device according to the present invention, the first inorganic layer, the polymer layer and the second inorganic layer are bonded by a chemical bond, thus can prevent external water and oxygen corrosion and improve bending resistance of the display device.

Manufacturing method of OLED display panel

The present invention provides a method of fabricating an organic light emitting diode display, including forming an exfoliation layer to be peeled off on the base substrate corresponding to two of the first predetermined area, the second predetermined area, and the third predetermined area; using a predetermined mask to form an organic light emitting layer on the exfoliation layer and the base substrate which is not covered by the exfoliation layer; and heating the base substrate to peel off the exfoliation layer and the organic light emitting layer on the exfoliation layer, while remaining the organic light emitting layer not covered by the exfoliation layer.

Method of fabricating organic light emitting diode display

An organic light emitting diode display panel includes a thin film transistor array layer disposed on a flexible substrate, and including thin film transistors, a reflective anode, and a pixel defining layer. The pixel defining layer has a patterned structure defining non-light emitting regions and light emitting regions, each being between the non-light emitting regions; a black matrix layer disposed on the non-light emitting regions; a light emitting module disposed on a surface of the black matrix layer and the pixel defining layer, and including a plurality of pixel units. Each pixel unit includes a red subpixel, a green subpixel, and a blue subpixel respectively correspondingly disposed in one light emitting region and disposed on the reflective anode; a filter film layer including a red filter, a green filter, and a blue filter respectively correspondingly disposed on one red subpixel, one green subpixel and one blue subpixel.

Organic light emitting display panel and method for manufacturing the same

An organic light emitting diode display device includes a flexible substrate, a pixel isolation layer, a plurality of pixels, a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer. The pixel isolation layer is disposed on the flexible substrate. The pixels are disposed on the flexible substrate. The first inorganic encapsulation layer is disposed on the pixels and includes at least one stress adjustment layer. The first organic encapsulation layer is disposed on the first inorganic encapsulation layer. The second inorganic encapsulation layer is disposed on the first organic encapsulation layer and covers the first inorganic encapsulation layer.

Organic light emitting diode display device

A method of manufacturing a thin film encapsulation layer includes providing a substrate provided with an organic light emitting diode (OLED) light emitting device; forming a barrier layer on the substrate, wherein the barrier layer surrounds the OLED light emitting device and includes an organic material having hydrophobic properties; forming a first inorganic encapsulation layer on the substrate, wherein the first encapsulation layer covers the OLED light emitting device; and removing the barrier layer.

Method of manufacturing a thin film encapsulation layer and organic light emitting diode display device

An organic light emitting diode (OLED) display panel and a encapsulation method of the organic light emitting diode display panel are provided. The encapsulation method includes steps of providing an OLED display panel having an OLED light emitting element layer in a display area thereof and an organic peeling layer in a non-display area thereof; laminating an inorganic film layer prepared in a full-surface coating method and an organic film layer only covering the display area sequentially; and peeling off the organic peeling layer together with the inorganic film layer on the surface of the organic peeling layer, so as to form a thin film encapsulation layer.

Organic light emitting diode display panel and method for encapsulating same

An organic light-emitting diode display is provided. The organic light-emitting diode display includes an organic light-emitting display layer having red light-emitting units, green light-emitting units, and blue light-emitting units; a first inorganic layer disposed on the organic light-emitting display layer; and a light filter layer including a plurality of light filter units to increase light extraction efficiency of the light filter layer. The light filter units include first light filter units, second light filter units, and third light filter units. The first light filter units are aligned with the red light-emitting units; the second light filter units are aligned with the green light-emitting units; and the third light filter units are aligned with the blue light-emitting units. Material of the light filter layer is ink.

An OLED display panel and manufacturing method thereof. The OLED display panel includes a TFT array substrate, organic light emitting units, a first barrier, a second barrier, a trench, and a thin film packaging structure. The first barrier and the second barrier are disposed in a non-display region. The trench is formed corresponding to the position of a gap between the first barrier and the second barrier. The trench is disposed in an insulating layer stacked structure of the TFT array substrate. The thin film packaging structure covers above elements. The trench is disposed in a straight-edge region and a height difference is formed between the straight-edge region and a corner region. This can efficiently lower the risk of overflow from the corner region to the outside for an organic layer of the thin film packaging structure.

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Wuhan, China

Hsianglun Hsu