Advanced Micro Devices Corporation

Hsiang Wan Liau

Raj N Master

Seah Sun Too

Maxat Touzelbaev

Janet Kirkland

Tek Seng Tan

Soon Tatt Ow Yong

Yeow Guan Teh

Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.

Void reduction in indium thermal interface material

Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.

Double-sided waffle pack

Growing community of inventors

Penang, Malaysia

Hsiang Wan Liau