Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Wuhan China Star Optoelectronics Technology Co., Ltd.

Huazhong University of Science and Technology

Hsiang Lun Hsu

Jing Huang

Jiangjiang Jin

Simin Peng

Yung Sheng Chen

Jun Cao

Meng Zhao

The present application provides a display panel comprising a substrate, a light-emitting device disposed on the substrate, a first inorganic layer and a second inorganic layer sequentially covering the light-emitting device; wherein the density of the second inorganic layer is larger than that of the first inorganic layer, so as to improve the barrier properties against water and oxygen of the display panel. The present application further provides a manufacturing method of a display panel. The encapsulation for the display panel can be improved in the present application.

Display panel and manufacturing method thereof

A flexible organic light emitting diode display and a manufacturing method thereof are provided. The manufacturing method includes steps of forming an active array layer and a photoresist layer sequentially on a flexible substrate, patterning the photoresist layer to form a plurality of pixel units, forming a light emitting main layer between two of the pixel units adjacent to each other, removing the pixel units with an organic solvent, forming a conductive transport layer on the light emitting main layer, and forming an encapsulation layer on the conductive transport layer.

Flexible organic light emitting diode display preventing current leakage between organic light emitting units

The present invention relates to a flexible OLED panel, thin-film encapsulation structure of flexible panel and encapsulation method for the same. The present invention includes a first inorganic layer, a first organic layer and a second inorganic layer structure, wherein the first organic layer is prepared by using hexamethyldisiloxane which is an organic material to form the first retaining wall. The hydrophilicity/hydrophobicity between the first retaining wall and the first organic layer is oppositely disposed such that the surface of the first retaining wall and the first organic layer do not mutually dissolve when contacted. The feature can greatly reduce the thickness of the at least one retaining wall. While ensuring that the flexible panel display region is shielded from external water oxygen, covering the particle contaminant of the flexible panel, buffering the stress during bending and folding, and the present invention has more simplified and more reliable features.

Flexible OLED panel, thin-film encapsulation structure of flexible panel and encapsulation method for the same

A flexible panel is provided. The flexible panel includes a substrate, an organic light-emitting diode device, a thin-film encapsulation layer and a retaining wall. Wherein the organic light-emitting diode device is formed on the substrate, the thin-film encapsulation layer is formed on the substrate and covers the organic light-emitting diode device, the retaining wall is disposed on the substrate and is around an outside of the organic light-emitting diode device. Wherein the first portion is closer to a light-emitting region of the flexible panel than the second portion. A manufacturing method for the flexible panel and a display device using the flexible panel are also disclosed.

Flexible panel, manufacturing method for the same and display device

Thin-film encapsulation structure of flexible panel having opposite hydrophilic/hydrophobic arrangement

A flexible OLED display panel is disclosed and includes an encapsulation structure. The encapsulation structure includes: a first inorganic thin film formed on a surface of an OLED display layer and a surrounding region of the surface; a first organic thin film formed on a surface of the first inorganic thin film; and a plurality of dams. Each of the dams has a first sub-dam close to the first inorganic thin film and a second sub-dam away from the first inorganic thin film. A gap is formed between the first sub-dam and the second sub-dam which are located at a same side. The gap is filled with desiccant.

Flexible OLED display panel and encapsulation method thereof

An OLED thin film encapsulation structure and a method of fabricating the same are provided. The OLED thin film encapsulation structure has: a substrate, a first organic layer disposed on the substrate; a first inorganic layer which is a hydrophobic layer; a second organic layer; a second inorganic layer which is disposed on the first inorganic layer and the second organic layer, and is a hydrophobic layer; and a plurality of first protrusions disposed with intervals on the first organic layer and/or the second organic layer.

OLED thin film encapsulation structure

The present disclosure relates to the field of liquid crystal display technology, and more particularly, to the flexible display panel and the manufacturing method thereof. The method includes forming the polymer on the anode layer from vapor of the organic dimer as the micro-cavity adjusting layer by the chemical vapor deposition method at the controlled temperature between 650&#xb0; C. to 750&#xb0; C. The structural formula of the organic dimer is as shown in Formula 1, wherein R is selected from one of H, F, Cl, and Br. The cathodic protective layer and the encapsulation layer can be formed by the same material and processes.  The present disclosure discloses preparing the micro-cavity adjustment layer, the cathodic protective layer, and the encapsulation layer of the flexible OLED with the same material, which can simplify the preparation processes.

Flexible display panels and manufacturing methods thereof

The present disclosure discloses a manufacturing method of organic light emitting device, and the steps of the manufacturing method comprises: manufacturing a bottom electrode on a base substrate; manufacturing an organic electro-emitting assembly on the bottom electrode by evaporation techniques and lithography techniques; and manufacturing a top electrode on the organic electro-emitting assembly. An organic light emitting device manufactured by the aforementioned method is further disclosed in the present invention. Hole transport layers corresponded to every emitting layers is manufactured by lithography technologies in the present disclosure; therefore, no fine metal mask is needed in use to reduce production cost and time; furthermore, properties of the organic light emitting device is increased simultaneously.

Organic light emitting device and method for manufacturing the same

A pixel structure and manufacturing method thereof are provided. The pixel structure includes: a substrate; an anode electrode layer disposed on the substrate; a plurality of pixel units disposed on the anode electrode layer in rectangular array, where each of the pixel units includes four sub-pixel units arranged in rectangular array, and the emitting colors of the two opposite sub-pixel units at the opposite sides of any two adjacent pixel units are the same; and a cathode electrode layer disposed on the pixel units.

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Guangdong, China

Hsiang Lun Hsu