Other

Western Digital Technologies, Inc.

Sandisk Technologies Inc.

Hsiang Ju Huang

Cong Zhang

Han-Shiao Chen

Xuyi Yang

Chien-Te Chen

Binbin Zheng

Chien Te Chen

Yu Ying Tan

Cheng-Hsiung Yang

Songtao Lu

In one example, the present application describes a Printed Circuit Board (PCB) that mitigates galvanic corrosion during an Organic Solderability Preservative (OSP) process used during fabrication of the PCB. The PCB includes a first metal pattern and a second metal pattern electrically coupled to each other, where the first and second metal patterns are different metals. The first metal pattern has a first area that is exposed by a solder mask layer, and the second metal pattern has a second area that is exposed by the solder mask area. A ratio of the first area to the second area is less than a threshold ratio to mitigate the galvanic corrosion of the second metal pattern exposed on the PCB during the OSP process.

Printed circuit board having a sacrificial pad to mitigate galvanic corrosion

A land grid array semiconductor device is disclosed which is configured for removable insertion to and from a host device. The land grid array semiconductor device may include a first set of one or more contact fingers on the first surface of the land grid array semiconductor device, and a second set of one or more contact fingers on the second surface of the land grid array semiconductor device. In order to electrically couple the second set of one or more contact fingers, one or more electrical connectors may be provided physically extending between the second set of one or more contact fingers and at least one of the substrate and the at least one semiconductor die.

Semiconductor device including contact fingers on opposed surfaces

A needle structure for injecting a filler and monitoring a blood backflow situation simultaneously includes a needle, a housing and a partitioning member. The needle includes a needle chamber and a needle opening connected to the needle chamber. The housing includes a housing chamber and a housing opening connected to the housing chamber, and the housing chamber is connected to the needle chamber to form a needle housing chamber. The partitioning member is disposed in the needle housing chamber. The needle housing chamber is separated into a first chamber and a second chamber by the partitioning member. The needle opening is separated into an injection opening and a blood backflow opening by the partitioning member. The first chamber is connected to the injection opening, and the blood backflow opening and the housing opening are connected by the second chamber.

Needle structure

Growing community of inventors

Taichung, Taiwan

Hsiang Ju Huang