Chunghwa Picture Tubes, Ltd.

Hsi-Ming Chang

Yen-Yu Huang

Yuan-Hao Chang

Shin-Chuan Chiang

Chia-Ming Chiang

Chia-Nan Shen

Ching-Hong Wong

A processing method of a substrate is provided. The substrate is processed by a substrate processing apparatus. The substrate processing apparatus includes a reaction chamber and a secondary chamber surrounding the reaction chamber. The processing method includes: placing the substrate in the reaction chamber; performing a process to increase a pressure in the reaction chamber and a pressure in the secondary chamber, such that the pressure in the secondary chamber is between an atmospheric pressure and the pressure in the reaction chamber; increasing a temperature in the reaction chamber; and processing the substrate by a supercritical fluid in the reaction chamber.

Method for processing substrate

A method for manufacturing a pixel structure is provided. A patterned semiconductor material layer, an insulation material layer, and a gate electrode material layer are formed in sequence on a substrate to form a stacked structure. A patterned photoresist layer is formed on the stacked structure by using a photomask. A portion of the stacked structure is removed to pattern the patterned semiconductor material layer into a patterned semiconductor layer by using the patterned photoresist layer as a mask. Another portion of the stacked structure is etched by using a portion of the patterned photoresist layer as a mask until a portion of the semiconductor layer in the stacked structure is exposed. Then, an exposed portion of the semiconductor layer is modified to increase a conductivity of the exposed portion of the semiconductor layer. Finally, the patterned photoresist layer is removed. A pixel structure manufactured by the method is provided.

Pixel structure

A method of manufacturing a pixel structure is provided. A gate and a gate insulating layer are formed on a substrate. A channel layer is formed on the gate insulating layer, and the material of the channel layer includes a first metal oxide semiconductor material. A source and a drain are formed on opposite sides of the channel layer. An insulating layer has an opening exposing the drain. First and second transparent electrode material layers are formed on the substrate sequentially, the material of the first transparent electrode material layer includes a second metal oxide semiconductor material, and the material of the second transparent electrode material layer includes a metal oxide conductive material. The first and second transparent electrode material layers are patterned using the same mask to form first and second transparent electrode layers, wherein the first transparent electrode layer is in contact with the drain through the opening.

Method of manufacturing pixel structure

The manufacturing method of the thin film transistor includes the following steps. A gate, a first insulating layer, a second insulating layer, a metal oxide semiconductor layer, a first etching stop layer, a second etching stop layer and a photoresist structure are sequentially formed. The second etching stop layer, the first etching stop layer, and the metal oxide semiconductor layer are patterned using the photoresist structure as a mask to form a pre-second etching stop pattern, a pre-first etching stop pattern, and a metal oxide semiconductor pattern. The pre-second etching stop pattern and the pre-first etching stop pattern are patterned using the remaining thick portion of the photoresist structure as a mask to form a second etching stop pattern and a first etching stop pattern, and a portion of the second insulating layer is removed to form an insulating pattern. A source and a drain are formed.

Thin film transistor and manufacturing method thereof

A thin film transistor disposed on a substrate, includes a gate, a gate insulation layer, a first source/drain, a semiconductor layer and a second source/drain. The gate is disposed on the substrate. The gate insulation layer covers the gate and the substrate. The first source/drain is disposed on the gate insulation layer. The semiconductor layer is disposed above the gate, extends from the gate insulation layer to the first source/drain, and includes a first portion disposed on the first source/drain and a second portion connected to the first portion. An electrical conductivity of the first portion is higher than that of the second portion. The second source/drain covers and is in contact with the second portion. A manufacturing method of thin film transistor is further provided.

Thin film transistor

A mask is provided. The mask includes a plurality of first rows of openings and a plurality of second rows of openings. Each of the first rows of openings includes a plurality of first openings arranged in a row. The first openings located at different first opening rows are aligned in a column direction. Each of the second opening rows includes a plurality of second openings arranged in a row. The second openings located at different second rows of openings are aligned in the column direction. The first opening rows and the second opening rows are disposed alternately, and any one of the second rows of openings is located between two adjacent first rows of openings. The first openings and the second openings are alternately arranged in the row direction.

Mask and fabrication method of organic light emitting material layer

A manufacturing method of an oxide semiconductor thin film transistor according to the disclosure includes the following. A source and a drain are formed. A channel layer is formed between the source and the drain, wherein the channel layer is separated from the source and the drain. An insulation layer is formed, wherein the insulation layer covers the source, the drain, and the channel layer. A first conductor is at least formed in a first opening of the insulation layer, wherein the first conductor contacts the source and the channel layer. A second conductor is at least formed in a second opening of the insulation layer, wherein the second conductor contacts the drain and the channel layer.

Manufacturing method of oxide semiconductor thin film transistor

An oxide semiconductor thin film transistor includes a source, a drain, a channel layer, an insulation layer, a first conductor and a second conductor. The channel layer is disposed between the source and the drain, and separated from the source and the drain. The insulation layer covers the source, the drain and the channel layer. The first conductor is at least disposed in a first opening of the insulation layer so as to touch the source and the channel layer. The second conductor is at least disposed in a second opening of the insulation layer so as to touch the drain and the channel layer.

Oxide semiconductor thin film transistor and manufacturing method thereof

The present provides a method for fabricating a thin film transistor including following steps. A substrate is provided. A gate is formed above the substrate. A first source is formed above the substrate. A channel is formed, in which one end of the channel contacts with the first source. A stop layer covering the one end of the channel and exposing another end of the channel is formed. A drain connected with the other end of the channel is formed. Moreover, the present invention also provides a thin film transistor fabricated by the method.

Thin film transistor and method for fabricating the same

An oxide semiconductor thin film transistor (TFT) substrate includes a substrate, a source, a drain, a patterned transparent conductive layer, an oxide semiconductor layer, a gate and a gate dielectric layer. The source and drain are disposed on the substrate. The patterned transparent conductive layer includes a first transparent electrode, a second transparent electrode and a pixel electrode. The first and second transparent electrodes respectively cover an upper surface of the source and an upper surface of the drain. The pixel electrode connects to the drain. The oxide semiconductor layer contacts the first and second transparent electrodes. The gate dielectric layer is interposed between the oxide semiconductor layer and the gate.

Oxide semiconductor thin film transistor substrate

A method for manufacturing an oxide semiconductor thin film transistor (TFT) is provided, which includes the steps below. A source electrode and a drain electrode are provided. A patterned insulating layer is formed to partially cover the source electrode and the drain electrode, and expose a portion of the source electrode and a portion of the drain electrode. An oxide semiconductor layer is formed to contact the portion of the source electrode and the portion of the drain electrode. A gate electrode is provided. A gate dielectric layer positioned between the oxide semiconductor layer and the gate electrode is provided. An oxide semiconductor TFT is also provided herein.

Oxide semiconductor thin film transistor and method for manufacturing the same

A pixel structure and a fabrication method thereof are provided. A scan line, a gate, an oxide conductor layer, a metal conductor layer, an oxide semiconductor layer, and an insulation layer between the gate and the metal conductor layer are formed on a substrate. The oxide conductor layer includes a pixel electrode and a first auxiliary pattern partially overlapped with where the gate is. The first auxiliary pattern includes a first metal contact portion and a first semiconductor contact portion. The metal conductor layer includes a data line, a source connected to the data line, and a drain separated from the source. The drain contacts the first metal contact portion, exposes the first semiconductor contact portion between the source and the drain, and is electrically connected to the pixel electrode. The oxide semiconductor layer is connected between the source and the drain and contacts the first semiconductor contact portion.

Fabrication method of a pixel structure and a pixel structure

A fabrication method of a minute pattern at least includes following steps. A first crystallizable material layer is formed on a base material. The first crystallizable material layer is patterned to form a plurality of first patterns on the base material. A distance between every two adjacent first patterns is greater than a width of each of the first patterns. A first treatment process is performed to crystallize the first patterns. A second crystallizable material layer is formed on the base material and covers the first patterns. The second crystallizable material layer is patterned to form a plurality of second patterns on the base material. Each of the second patterns is located between the first patterns adjacent thereto, respectively.

Fabrication method of minute pattern

A pixel array including first signal lines, second signal lines, switch devices, and pixel units coupling to the first signal lines and the second signal lines through the switch devices is provided. The first signal lines and the second signal lines are formed on different films. Each of the pixel units includes a common electrode line. In each of the pixel units of an irow, the common electrode line has at least one first line segment and at least one second segment coupled to each other and formed on different films, and a distance between an (i&#x2212;1)first signal line and the first line segment is not equal to that between the (i&#x2212;1)first signal line and the second line segment. The first signal lines are either scan lines or data lines of the pixel array, and the second signal lines are the other kind.

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Taoyuan County, Taiwan

Hsi-Ming Chang