Altek Biotechnology Corporation

Hsi-Hsin Loo

Liang-Yi Li

Chao-Yu Chou

Chun-Wei Liu

Parn-Far Chen

An endoscopy system including a flexible insertion tube, a motion sensing module and a processor is provided. The flexible insertion tube has a central axis. The motion sensing module includes a housing, patterns and sensors. The patterns are disposed at a surface of the flexible insertion tube according to an axial orientation distribution and an angle distribution based on the central axis. The sensors are disposed in the housing and located beside a guiding hole of the housing. The processor is disposed in the housing. During relative motion of the flexible insertion tube with respect to the motion sensing module via the guiding hole, the sensors are configured to sense a motion state of the patterns so as to obtain a motion-state sensing result. The processor determines insertion depth information and insertion tube rotating angle information according to the motion-state sensing result, the axial orientation distribution and the angle distribution.

Endoscopy system

An endoscopy system including an insertion tube segment, a handle segment, at least one heat source, a heat pipe and a heat-conductive material is provided. The insertion tube segment has first and second end portions opposite to each other and is inserted in the handle segment. An inside of the insertion tube segment and an inside of the handle segment commonly have a connecting space. The at least one heat source is disposed in the first end portion. The heat pipe is disposed in the connecting space and at least extends from a portion of the connecting space of the insertion tube segment to a portion of the connecting space of the handle segment. The heat-conductive material is disposed between the at least one heat source and the first end portion, and the heat-conductive material is thermally coupled to the at least one heat source and the heat pipe, respectively.

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

Endoscope device and cable assembly thereof

A microelectronic device includes an accommodating housing, a circuit board, an electronic component, and a conducting wire. The accommodating housing has an accommodating space therein. The circuit board is disposed within the accommodating space, and has a first and a second end surface disposed opposite to each other. The first end surface includes a first conductive contact, and a lateral side of the circuit board includes a receiving hole being a half-open hole extending from the second end surface. A second conductive contact is disposed on the surface of the receiving hole and electrically connected to the first conductive contact via an internal power layer of the circuit board. The electronic component is disposed on the first end surface and electrically connected to the first conductive contact. One end of the conducting wire is disposed in the receiving hole and electrically connected to the second conductive contact.

Growing community of inventors

Hsinchu, Taiwan

Hsi-Hsin Loo