Industrial Technology Research Institute

Hsi-Harng Yang

Chuan-Kang Mu

Min-Chieh Chou

Shih-Chou Chen

Cheng-Tang Pan

Jauh-Jung Yang

A fabrication method and forming mold for multi-fiber optical connector ferrules uses X-ray LIGA technology to integrally form a plurality of fiber bores and guide bores in an aligning mold in an array manner with great precision of bores size and alignment positions. Then a plurality of fiber pins and guide pins are engaged with the fiber bores and guide bores to form the mold core. The mold core is then housed between a pair of side walls and an upper mold and a lower mold for injection molding process. The ferrules thus may be produced with great precision.

Fabrication method and forming mold for multi-fiber optical-connector ferrules

A manufacturing method for a high precision mold comprises the steps of (a) placing a plastic body on a conductor substrate, (b) forming a plurality of perforating apertures in the plastic body using X-ray deep etching molding, (c) rounding the edges at the front end of the perforating apertures using ultraviolet (UV) lithography, and (d) electroforming the high precision mold using the plastic body with perforating apertures as a model. A fiber connector sleeve can be further manufactured by (e) molding a fiber aligning element using the high precision mold, (f) molding a fiber sleeve body using an usual mold, and (g) combining the fiber aligning element with the fiber sleeve body using ultrasonic waves to form the fiber connector sleeve.

Manufacturing method for high precision mold

A method of making molds for use in manufacturing high precision and high density multiple-lead microstructures. If employs microphoto etching process used in semiconductor manufacturing process to project X-ray and ultraviolet light on a photoresist layer through a X-ray co-mask and a generally used mask to produce exposing process. Through etching and electroplating processes, a plurality of identical punch molds may be made. The punch molds are aligned stacked up one upon the other until a desired height is reached. The stacked up punch molds are electroplated to form a lead punch die for producing microparts desired.

Growing community of inventors

Changhua Hsien, Taiwan

Hsi-Harng Yang