Jsr Corporation

Japan Synthetic Rubber Co., Ltd.

Nippon Paint Compnay, Ltd.

Hozumi Sato

Takashi Nishioka

Katsuo Koshimura

Toshiyuki Ota

Naoki Sugiyama

Kazunori Kanda

Shin-ichiro Iwanaga

Hisaichi Muramoto

Yasuhiko Takemura

Hiroji Enyo

Koichi Ueda

Tadahiro Kakiuchi

Kimiyasu Sano

Kenji Yasuda

Akira Nishikawa

Manabu Sekiguchi

Yuichi Hashiguchi

Takayoshi Tanabe

Yoshiaki Kawamura

Masako Suzuki

Hideki Chiba

Yasuhiro Yoshida

Hisao Ono

Noboru Oshima

Kinji Yamada

Atsushi Shiota

Yasuaki Yokoyama

Toshio Miyabayashi

Isamu Mochizuki

Noboru Ohshima

Katsutoshi Igarashi

Masaru Ohta

Yoshiharu Hashiguchi

Takumi Miyachi

Kazuaki Niwa

Masanobu Nagano

Ryoji Setaka

Toshio Ohhara

Tatsuaki Matsunaga

Takeo Hara

Hiroshi Ise

Yukihiro Sawada

Humito Shimada

Masaru Oota

Tadaaki Nishi

Kouichi Hirose

Akio Sakaguchi

Fusaka Watanabe

Tatuaki Matunaga

Yoshiyuki Michino

Hideaki Tashiro

A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.

Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure

Oxetane compound, oxetane copolymer, and process for producing the oxetane compound

A positive-tone photosensitive resin composition for forming a thick film which is suitably used for photofabrication such as manufacture of circuit boards, a photosensitive resin film, and a method of forming a bump using the same. The photosensitive resin composition comprising (A) a novolac resin with a weight average molecular weight of 2,000-30,000, (B) a polyvinyl lower alkyl ether, (C) a polyphenol derivative compound with a molecular weight of 200-1,000, and (D) a compound containing a naphthoquinonediazido group.

Photosensitive resin composition, photosensitive resin film, and method of forming bumps using same

An olefin polymer and a curable resin composition which can form cure coatings with excellent transparency, low reflectance, and high scratch resistance, an antireflection film exhibiting excellent transparency, low reflectance, and high scratch resistance are disclosed. The olefin polymer comprises a polysiloxane segment in the main chain, has 30 wt % or more fluorine content, and has a polystyrene-reduced number average molecular weight of 5,000 or more. The curable resin composition comprises the olefin polymer. The antireflection film is made from the cured product of the curable resin composition.

Olefin polymer, process for manufacturing the same, curable resin composition, and antireflection coating

Disclosed is a photo-curable composition comprising the following components (A) to (C): (A) hydrolyzable silane compound represented by the general formula (1) or a hydrolyzate thereof: (R,),Si(X),(1) wherein R,is a non-hydrolyzable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer of 0 to 3; (B) photo acid generator; and (C) dehydrating agent. By such constitution, it is possible to provide a photo-curable composition which has a rapid photo-curable rate, is excellent in characteristics such as storage stability, heat resistance, weather-ability, scratch resistance and the like, and is applicable to base materials having low heat resistance such as plastics, as well as a cured product obtained therefrom.

Photo-curable composition and photo-cured product

A radiation-sensitive resin composition comprising: (A) a phenol resin, (B) an amino resin, (C) a compound having two or more crosslinking groups in a molecule, and (D) a halomethyl-1,3,5-triazine compound. The composition can form insulating layers exhibiting high resolution, high plating solution resistance, high adhesion to conductor wiring, and developability using an alkaline aqueous solution, producing cured insulating layers with superior solvent resistance, excellent waterproofing characteristics, and high heat resistance. The composition is useful for fabricating multilayered wiring boards.

Radiation-sensitive resin composition

A coating composition comprising (A) a fluorine-containing polymer, (B) a compound represented by the following general formula (1) or a partial condensation product thereof,

Coating composition

A radiation sensitive resin composition comprising an alkali-soluble resin such as a polyvinyl phenol or a phenol resin other than a polyvinyl phenol having a weight average molecular weight of 2,000 or higher, a cross-linking agent such as an amino resin having two or more active methylol groups in a molecule, a particulate rubbery material comprising a cross-linked polymer chemically modified with an epoxy compound, a liquid rubbery material having a number average molecular weight between 1,000 and 10,000 and a glass transition temperature of -20.degree. C. or lower, and a radiation polymerization initiator. The composition is best suited for use as a material for preparing an insulating layer interposed between two layers of conductive wiring that are arranged in an overlaying stack.

Radiation sensitive resin composition

A negative photoresist stripping liquid composition is provided which comprises from 30 to 75% by weight of dimethyl sulfoxide, from 20 to 65% by weight of 1,3-dimethyl-2-imidazolidinone, from 0.1 to 5% by weight of a tetraalkylammonium hydroxide and from 0.5 to 15% by weight of water. The composition has a superior stripping performance especially against photoresists that are alkali-developable and can form films of at least 20 .mu.m in thickness, and has no problem of freezing even when stored outdoors in the winter. The composition is useful for the stripping of negative photoresists for bump formation and for fabricating circuit substrates.

Negative photoresist stripping liquid composition

A radiation sensitive resin composition comprising:

Radiation sensitive resin composition and material for forming bumps

A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.

Positive photoresist composition

The present invention provides a photosensitive resin composition which is superior in water-developing properties, resilience, strength of resin plate after exposure, elongation at break, and transparency of resin plate. The composition comprises:

Water-developing photosensitive resin composition

A photosensitive resin composition is provided which is excellent in water developability, impact resilience, resin plate strength after exposure, breaking extension, and resin-plate transparency. The composition comprises:

Water-developable photosensitive resin composition

A photo-sensitive resin composition is provided which contains (1) a particulate polymer of a carboxy-group-containing-diene having a cross-linked structure; (2) a polymer having two or more photo-polymerizable unsaturated groups at its molecular chain terminals, and, optionally, a photo-polymerizable unsaturated group, carboxyl group, hydroxy group, amino group, or epoxy group in side chains, or (2') a non-diene-type polymer having a photo-polymerizable unsaturated group, carboxyl group, hydroxy group, amino group, or epoxy group in side chains, or a low molecular weight linear diene-type polymer; (3) a photo-polymerizable unsaturated monomer; (4) a polymer containing an amino group; and (5) a photo-polymerization initiator. The photo-sensitive resin composition has excellent water-developing capability and shows almost no swelling in water, causing minimal reduction in strength and only minimal dimensional changes during development. Resin plates prepared from the composition possess excellent strength after exposure to light, excellent elongation at break, impact resilience and superb transparency, providing a good characteristic balance of properties.

Water developable photosensitive resin composition

A water-developable photosensitive resin composition which exhibits a small swelling, small reduction in strength and small dimension change when developed with water and which has an excellent balance of characteristics. Said composition comprises (1) a oarboxyl group-containing diene polymer, (2) a hydrogenated diene block polymer in which at least 80% of the double bonds in the recurring unit consisting of conjugated diene has been hydrogenated, (3) a photopolymerizable ethylenically unsaturated monomer, (4) an amino group-containing compound and (5) a photopolymerization initiator.

Photosensitive resin composition comprising a carboxyl group-containing

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Tokyo, Japan

Hozumi Sato